REVISIONS
LTR
L
M
DESCRIPTION
Incorporated NOR's 5962-R110-94 and 5962-R013-96. Made
Changes to table I for device type 07. Redraw entire document.
Inactivate device types 03, 04, and 07 for new design. Add device
type 10.
DATE
(YR-MO-DA)
96-06-20
98-01-28
APPROVED
K.A. Cottongim
K. A. Cottongim
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
M
15
M
16
M
17
M
18
REV
SHEET
PREPARED BY
Donald R. Osborne
M
19
M
20
M
21
M
1
M
2
M
3
M
4
M
5
M
6
M
7
M
8
M
9
M
10
M
11
M
12
M
13
M
14
PMIC N/A
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DEFENSE SUPPLY CENTER COLUMBUS
P. O. BOX 3990
COLUMBUS, OHIO 43216-5000
CHECKED BY
D. A. Dicenzo
APPROVED BY
N. A. Hauck
MICROCIRCUIT, HYBRID, DIGITAL, DUAL CHANNEL, 15
VOLT DRIVER-RECEIVER, RECEIVER IDLE NORMALLY
LOW
DRAWING APPROVAL DATE
87-08-06
SIZE
CAGE CODE
REVISION LEVEL
M
AMSC N/A
A
SHEET
67268
1
OF
21
5962-87579
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E067-98
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-87579
Drawing number
01
Device type
(See 1.2.1)
X
Case outline
(See 1.2.2)
X
Lead finish
(See 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device types
01
02
03
04
05
06
07
08
09
10
2/
3/
3/
4/
3/
Generic number
BUS-63125, BUS-63126
BUS-63125II, BUS-63126II
ARX2411
ARX3411
NHI-1500
FC 1553623
CT1487-D
MR63125M
FC 1553621
ACT4487-D
Circuit function 1/
Dual channel, driver-receiver
Low power, dual channel, driver-receiver
Dual channel, driver-receiver
Low power, dual channel, driver-receiver
Low power, dual channel, driver-receiver
Low power, dual channel, driver-receiver with thermal protection
Low power, dual channel, driver-receiver
Low power, dual channel, driver-receiver
Low power, dual channel, driver-receiver
Low power, dual channel, driver-receiver
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
U
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
28
36
36
28
Package style
Dual-in-line
Duall-in-line
Flat package
Flat package
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1/
2/
3/
4/
Interfaces with Manchester encoder-decoder described in Standard Microcircuit Drawing 78029.
Inactive for new design as of revision A, dated 88 SEP 20.
Device types 03, 04, and 07 are inactive for new design. Device type 10 replaces device types 03, 04, and 07.
For device type 06 only, the the thermal protection operation is as follows:
With the thermal overide pins 4 and 13 disconnected transmission amplitude decreases as case temperature exceeds
approximately 175(C and is restored as case temperature decreases. With pins 4 and 13 connected to 0 volts this feature is
effectively disabled.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
M
5962-87579
SHEET
2
1.3 Absolute maximum ratings. 1/
Supply voltage range:
V
CC
(devices 01, 03, 04, 05, 07, 08, and 10) . . . . . . . . . . . . .
V
EE
(devices 01-04, 06, 07, 08, 09, and 10) . . . . . . . . . . . . .
V
CC1
(all devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver differential voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver common mode voltage range . . . . . . . . . . . . . . . . . .
Driver peak output current . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power dissipation (P
D
) at T
C
= +125(C:
(devices 01 and 08) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 03) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(devices 04 and 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 05) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(devices 06 and 09) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 07) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . .
Junction temperature (T
J
):
(devices 01-04, 06, 07, 08, 09, and 10) . . . . . . . . . . . . . . . .
(device 05) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal resistance, junction-to-case (
JC
):
(devices 01 and 05) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(devices 02, 08, and 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 03) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(devices 06 and 09) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 07) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal resistance, junction-to-ambient (
JA
):
(devices 01 and 05) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(devices 02, 08, and 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 03) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(devices 06 and 09) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(device 07) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended operating conditions.
Supply voltage range:
V
CC
(devices 01, 03, 04, 05, 07, and 10) . . . . . . . . . . . . . . . .
V
CC
(device 08) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
EE
(devices 01-04, 06, 07, 09, and 10) . . . . . . . . . . . . . . . .
V
EE
(device 08) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
CC1
(all devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver differential voltage:
(devices 01, 02, 03, 06, and 09) . . . . . . . . . . . . . . . . . . . . . .
(devices 04, 05, 07, 08, and 10) . . . . . . . . . . . . . . . . . . . . . .
Receiver common mode voltage range:
(devices 01, 02, 03, 04, 06, and 09) . . . . . . . . . . . . . . . . . . .
(devices 05, 07, 08, and 10) . . . . . . . . . . . . . . . . . . . . . . . . .
1/
2/
+14.25 V dc to +15.75 V dc
+11.25 V dc to +15.75 V dc
-14.25 V dc to -15.75 V dc
-11.25 V dc to -15.75 V dc
+4.5 V dc to +5.5 V dc
0 V dc to +5 V dc
30 V
P-P
40 V
P-P
-5 V dc to +5 V dc
-10 V dc to +10 V dc
-0.3 V dc to +18 V dc
+0.3 V dc to -18 V dc
-0.3 V dc to +7 V dc
-0.3 V dc to V
CC1
40 V
P-P
-10 V dc to +10 V dc
200 mA
4W
3W
3.3 W 2/
2W
2/
0.96 W 2/
1.65 W 2/
3W
-65(C to +150(C
+300(C
+160(C
+150(C
8.8(C/W
7.0(C/W
47.2(C/W
88(C/W
18(C/W
60(C/W
28.8(C/W
27.0(C/W
67.2(C/W
108(C/W
35(C/W
80(C/W
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
One channel transmitting at 100 percent duty cycle and the second channel at standby.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
M
5962-87579
SHEET
3
1.4 Recommended operating conditions - Continued.
Driver peak output current (all devices) . . . . . . . . . . . . . . . . . .
Serial data rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature (T
J
):
(devices 01, 02, 03, 05, 06, 08, 09, and 10) . . . . . . . . . . . . .
(devices 04 and 07) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case operating temperature range (T
C
) . . . . . . . . . . . . . . . . . .
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbook. The following specification, standards, and handbook form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Microcircuit Case Outlines.
HANDBOOK
DEPARTMENT OF DEFENSE
MIL-HDBK-780 - Standard Microcircuit Drawings.
MIL-HDBK-1553 - Multiplex Applications Handbook.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements shall be in accordance with MIL-PRF-38534.
Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's
Quality Management (QM) plan or as designated for applicable device class. Therefore, the tests and inspections herein may
not be performed for applicable device class (see MIL-PRF-38534). Futhermore, the manufacturers may take exceptions or use
alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined
in MIL-PRF-38534 shall be met for the applicable device class. The modification in the QM plan shall not affect the form, fit, or
function as described herein.
180 mA
1.0 MHz maximum
+150(C
+160(C
-55(C to +125(C
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
M
5962-87579
SHEET
4
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 and figure 1 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Timing waveforms. Timing waveforms shall be as specified on figure 3.
3.2.4 Typical bus connections. Typical bus connections shall be as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in QML-38534.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified
in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or
function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in test method 1015 of MIL-STD-883.
T A as specified in accordance with table I of method 1015 of MIL-STD-883.
(2)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
M
5962-87579
SHEET
5
NXP MCU
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