MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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Advance Information
TMOS E-FET.
™
Power Field Effect Transistor
D3PAK for Surface Mount
The D3PAK package has the capability of housing the largest chip
size of any standard, plastic, surface mount power semiconductor.
This allows it to be used in applications that require surface mount
components with higher power and lower RDS(on) capabilities. This
high voltage MOSFET uses an advanced termination scheme to
provide enhanced voltage–blocking capability without degrading
performance over time. In addition, this advanced TMOS E–FET is
designed to withstand high energy in the avalanche and commuta-
tion modes. The new energy efficient design also offers a drain–to–
source diode with a fast recovery time. Designed for high voltage,
high speed switching applications in surface mount PWM motor
controls and both ac–dc and dc–dc power supplies. These devices
are particularly well suited for bridge circuits where diode speed and
commutating safe operating areas are critical and offer additional
safety margin against unexpected voltage transients.
MTV25N50E
TMOS POWER FET
25 AMPERES
500 VOLTS
RDS(on) = 0.200 OHM
N–Channel Enhancement–Mode Silicon Gate
®
D
N–Channel
G
CASE 433–01, Style 2
D3PAK Surface Mount
•
Robust High Voltage Termination
S
•
Avalanche Energy Specified
•
Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
•
Diode is Characterized for Use in Bridge Circuits
•
IDSS and VDS(on) Specified at Elevated Temperature
•
Short Heatsink Tab Manufactured – Not Sheared
•
Specifically Designed Leadframe for Maximum Power Dissipation
•
Available in 24 mm, 13–inch/500 Unit Tape & Reel, Add –RL Suffix to Part Number
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted)
Rating
Drain–to–Source Voltage
Drain–to–Gate Voltage (RGS = 1.0 MΩ)
Gate–to–Source Voltage — Continuous
Drain Current — Continuous
Drain Current
— Continuous @ 100°C
Drain Current
— Single Pulse (tp
≤
10
µs)
Total Power Dissipation
Derate above 25°C
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc, Peak IL = 25 Apk, L = 3.0 mH, RG = 25
Ω
)
Thermal Resistance — Junction to Case
Thermal Resistance
— Junction to Ambient
Thermal Resistance
— Junction to Ambient (1)
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
Symbol
VDSS
VDGR
VGS
ID
ID
IDM
PD
TJ, Tstg
EAS
R
θJC
R
θJA
R
θJA
TL
Value
500
500
±20
25
15.8
88
250
2.0
– 55 to 150
938
0.5
62.5
35
260
Unit
Vdc
Vdc
Vdc
Adc
Apk
Watts
W/°C
°C
mJ
°C/W
°C
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E–FET is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
©
Motorola TMOS
Motorola, Inc. 1996
Power MOSFET Transistor Device Data
1
MTV25N50E
ELECTRICAL CHARACTERISTICS
(TJ = 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250
µAdc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(VDS = 500 Vdc, VGS = 0 Vdc)
(VDS = 500 Vdc, VGS = 0 Vdc, TJ = 125°C)
Gate–Body Leakage Current (VGS =
±20
Vdc, VDS = 0 Vdc)
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250
µAdc)
Threshold Temperature Coefficient (Negative)
Static Drain–to–Source On–Resistance (VGS = 10 Vdc, ID = 12.5 Adc)
Drain–to–Source On–Voltage
(VGS = 10 Vdc, ID = 25 Adc)
(VGS = 10 Vdc, ID = 12.5 Adc, TJ = 125°C)
Forward Transconductance (VDS = 15 Vdc, ID = 12.5 Adc)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Transfer Capacitance
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Gate Charge
(See Figure 8)
(VDS = 400 Vdc, ID = 25 Adc,
VGS = 10 Vdc)
(VDD = 250 Vdc, ID = 25 Adc,
VGS = 10 Vdc,
RG = 9.1
Ω)
td(on)
tr
td(off)
tf
QT
Q1
Q2
Q3
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 25 Adc, VGS = 0 Vdc)
(IS = 25 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
—
—
trr
(IS = 25 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/µs)
Reverse Recovery Stored Charge
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the drain lead 0.25″ from package to center of die)
Internal Source Inductance
(Measured from the source lead 0.25″ from package to source bond pad)
(1) Pulse Test: Pulse Width
≤
300
µs,
Duty Cycle
≤
2%.
(2) Switching characteristics are independent of operating junction temperature.
LD
—
LS
—
13
—
5.0
—
nH
nH
ta
tb
QRR
—
—
—
—
0.9
0.79
501
332
170
9.42
1.1
—
—
—
—
—
µC
ns
Vdc
—
—
—
—
—
—
—
—
37
137
118
112
132
29
63
61
70
280
240
230
180
—
—
—
nC
ns
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Ciss
Coss
Crss
—
—
—
4700
520
200
6580
728
280
pF
VGS(th)
2.0
—
RDS(on)
VDS(on)
—
—
gFS
11
5.4
—
17
6.0
5.3
—
mhos
—
2.9
7.0
0.19
4.0
—
0.2
Vdc
mV/°C
Ohm
Vdc
V(BR)DSS
500
—
IDSS
—
—
IGSS
—
—
—
—
10
100
100
nAdc
—
0.51
—
—
Vdc
mV/°C
µAdc
Symbol
Min
Typ
Max
Unit
Reverse Recovery Time
2
Motorola TMOS Power MOSFET Transistor Device Data
MTV25N50E
TYPICAL ELECTRICAL CHARACTERISTICS
50
TJ = 25°C
I D , DRAIN CURRENT (AMPS)
40
VGS = 10 V
9V
8V
50
7V
I D , DRAIN CURRENT (AMPS)
40
VDS
w
10 V
30
6V
30
100°C
20
20
25°C
10
5V
4V
10
TJ = –55°C
16
20
0
2
3
4
5
6
7
8
0
0
4
8
12
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
Figure 1. On–Region Characteristics
R DS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
R DS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
Figure 2. Transfer Characteristics
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
10
20
30
ID, DRAIN CURRENT (AMPS)
40
50
– 55°C
25°C
VGS = 10 V
TJ = 100°C
0.28
TJ = 25°C
0.26
0.24
VGS = 10 V
15 V
0.22
0.20
0.18
0
10
20
30
ID, DRAIN CURRENT (AMPS)
40
50
Figure 3. On–Resistance versus Drain Current
and Temperature
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
RDS(on) , DRAIN–TO–SOURCE RESISTANCE
(NORMALIZED)
2.5
VGS = 10 V
ID = 12.5 A
10000
VGS = 0 V
TJ = 125°C
100°C
I DSS , LEAKAGE (nA)
1000
2.0
1.5
1.0
100
25°C
0.5
0
–50
0
50
100
TJ, JUNCTION TEMPERATURE (°C)
150
10
0
100
200
300
400
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
500
Figure 5. On–Resistance Variation with
Temperature
Figure 6. Drain–To–Source Leakage
Current versus Voltage
Motorola TMOS Power MOSFET Transistor Device Data
3
MTV25N50E
POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge controlled.
The lengths of various switching intervals (∆t) are deter-
mined by how fast the FET input capacitance can be charged
by current from the generator.
The published capacitance data is difficult to use for calculat-
ing rise and fall because drain–gate capacitance varies
greatly with applied voltage. Accordingly, gate charge data is
used. In most cases, a satisfactory estimate of average input
current (IG(AV)) can be made from a rudimentary analysis of
the drive circuit so that
t = Q/IG(AV)
During the rise and fall time interval when switching a resis-
tive load, VGS remains virtually constant at a level known as
the plateau voltage, VSGP. Therefore, rise and fall times may
be approximated by the following:
tr = Q2 x RG/(VGG – VGSP)
tf = Q2 x RG/VGSP
where
VGG = the gate drive voltage, which varies from zero to VGG
RG = the gate drive resistance
and Q2 and VGSP are read from the gate charge curve.
During the turn–on and turn–off delay times, gate current is
not constant. The simplest calculation uses appropriate val-
ues from the capacitance curves in a standard equation for
voltage change in an RC network. The equations are:
td(on) = RG Ciss In [VGG/(VGG – VGSP)]
td(off) = RG Ciss In (VGG/VGSP)
The capacitance (Ciss) is read from the capacitance curve at
a voltage corresponding to the off–state condition when cal-
culating td(on) and is read at a voltage corresponding to the
on–state when calculating td(off).
At high switching speeds, parasitic circuit elements com-
plicate the analysis. The inductance of the MOSFET source
lead, inside the package and in the circuit wiring which is
common to both the drain and gate current paths, produces a
voltage at the source which reduces the gate drive current.
The voltage is determined by Ldi/dt, but since di/dt is a func-
tion of drain current, the mathematical solution is complex.
The MOSFET output capacitance also complicates the
mathematics. And finally, MOSFETs have finite internal gate
resistance which effectively adds to the resistance of the
driving source, but the internal resistance is difficult to mea-
sure and, consequently, is not specified.
The resistive switching time variation versus gate resis-
tance (Figure 9) shows how typical switching performance is
affected by the parasitic circuit elements. If the parasitics
were not present, the slope of the curves would maintain a
value of unity regardless of the switching speed. The circuit
used to obtain the data is constructed to minimize common
inductance in the drain and gate circuit loops and is believed
readily achievable with board mounted components. Most
power electronic loads are inductive; the data in the figure is
taken with a resistive load, which approximates an optimally
snubbed inductive load. Power MOSFETs may be safely op-
erated into an inductive load; however, snubbing reduces
switching losses.
12000
11000
10000
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
–10
Crss
Ciss
VDS = 0 V
VGS = 0 V
100000
TJ = 25°C
10000
VGS = 0 V
TJ = 25°C
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
Ciss
1000
Coss
100
Crss
Ciss
Crss
–5
VGS
0
VDS
5
10
15
20
Coss
10
25
10
100
1000
GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS)
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 7a. Capacitance Variation
Figure 7b. High Voltage Capacitance Variation
4
Motorola TMOS Power MOSFET Transistor Device Data
MTV25N50E
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
12
10
8
VDS
6
4
2
0
0
25
50
75
100
Qg, TOTAL GATE CHARGE (nC)
125
Q2
Q3
QT
VGS
600
500
400
1000
TJ = 25°C
ID = 25 A
VDD = 250 V
VGS = 10 V
t, TIME (ns)
VDS , DRAIN–TO–SOURCE VOLTAGE (VOLTS)
td(off)
tr
tf
td(on)
100
300
Q1
200
100
0
150
TJ = 25°C
ID = 25 A
10
1
10
RG, GATE RESISTANCE (OHMS)
100
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
25
TJ = 25°C
VGS = 0 V
I S , SOURCE CURRENT (AMPS)
20
15
10
5.0
0
0.54
0.62
0.78
0.70
0.86
VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS)
0.94
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is for-
ward biased. Curves are based upon maximum peak junc-
tion temperature and a case temperature (TC) of 25°C. Peak
repetitive pulsed power limits are determined by using the
thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance–General
Data and Its Use.”
Switching between the off–state and the on–state may tra-
verse any load line provided neither rated peak current (IDM)
nor rated voltage (VDSS) is exceeded and the transition time
(tr,tf) do not exceed 10
µs.
In addition the total power aver-
aged over a complete switching cycle must not exceed
(TJ(MAX) – TC)/(R
θJC
).
A Power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For reli-
able operation, the stored energy from circuit inductance dis-
sipated in the transistor while in avalanche must be less than
the rated limit and adjusted for operating conditions differing
from those specified. Although industry practice is to rate in
terms of energy, avalanche energy capability is not a con-
stant. The energy rating decreases non–linearly with an in-
crease of peak current in avalanche and peak junction
temperature.
Although many E–FETs can withstand the stress of drain–
to–source avalanche at currents up to rated pulsed current
(IDM), the energy rating is specified at rated continuous cur-
rent (ID), in accordance with industry custom. The energy rat-
ing must be derated for temperature as shown in the
accompanying graph (Figure 12). Maximum energy at cur-
rents below rated continuous ID can safely be assumed to
equal the values indicated.
Motorola TMOS Power MOSFET Transistor Device Data
5
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