REVISIONS
LTR
C
DESCRIPTION
Update boilerplate of document. Add devices 06 and 07. Add vendor
CAGE 61772 as source of supply for devices 06 and 07. Editorial
changes throughout.
Changes in accordance with NOR 5962-R187-95
Updated boilerplate to one-part, one-part number format. Added
provisions for the inclusion of radiation-hardened devices. - glg
Drawing updated to reflect current requirements. - glg
Updated boilerplate paragraphs. Added 08 device. ksr
Added packages T and N. Dose rate and total dose numbers were
changed; vendor had not previously shipped radhard devices. ksr
DATE (YR-MO-DA)
93-11-15
APPROVED
M. A. Frye
D
E
F
G
H
95-08-14
00-01-21
01-01-17
01-07-27
02-02-04
M. A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
STANDARD MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
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REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Ray Monnin
APPROVED BY
Michael. A. Frye
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DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
DRAWING APPROVAL DATE
08 Nov 1989
REVISION LEVEL
H
MICROCIRCUITS, MEMORY,
DIGITAL, CMOS, 4K X 9 FIFO,
MONOLITHIC SILICON
SIZE
A
SHEET
1 OF
31
5962-E221-02
CAGE CODE
67268
5962-89568
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN shall be as shown in the following example:
For device classes M and Q not using class designator in the PIN:
5962
|
|
|
Federal
stock class
designator
\
\/
Drawing number
For device classes Q and V where class designator is included in the PIN:
5962
|
|
|
Federal
stock class
designator
\
\/
Drawing number
1.2.1 (RHA) designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
Generic number
7204
7204
7204
7204
7204
7204
7204
7204
Circuit function
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO
4K X 9-bit parallel FIFO (very low power)
Access time
120 ns
80 ns
65 ns
50 ns
40 ns
30 ns
20 ns
15 ns
D
|
|
|
RHA
designator
(see 1.2.1)
/
89568
01
|
|
|
Device
type
(see 1.2.2)
Q
|
|
|
Device
class
designator
(see 1.2.3)
X
|
|
|
Case
outline
(see 1.2.4)
C
|
|
|
Lead
finish
(see 1.2.5)
-
|
|
|
RHA
designator
(see 1.2.1)
/
89568
01
|
|
|
Device
type
(see 1.2.2)
X
|
|
|
Case
outline
(see 1.2.4)
X
|
|
|
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
listed below.
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for non-JAN class B microcircuits in
accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
5962-89568
SHEET
2
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
X
Y
Z
U
T
N
Descriptive designator
GDIP1-T28 or CDIP2-T28
GDFP2-F28
CQCC1-N32
GDIP4-T28 or CDIP3-T28
See figure 1
See figure 1
Terminals
28
28
32
28
28
28
Package style
dual-in-line package
flat package
rectangular chip carrier
dual-in-line package
dual-in-line package
flat package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Terminal voltage with respect to ground....................................
DC output current ......................................................................
Storage temperature range .......................................................
Maximum power dissipation ......................................................
Lead temperature (soldering, 10 seconds)................................
Thermal resistance, junction-to-case (θ
JC
) ................................
Junction temperature (T
J
) ..........................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)........................................................
Minimum high level input voltage (V
IH
) ......................................
Input low voltage (V
IL
) ................................................................
Case operating temperature range (T
C
) ....................................
1.5 Radiation features.
Maximum total dose available (dose rate = 0.1 rad/s) ---------------------------
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
10 K Rads(Si)
+4.5 V dc to +5.5 V dc
2.2 V dc minimum 2/
0.8 V dc maximum 3/
-55°C to +125°C
-0.5 V dc to +7.0 V dc
50 mA
-65°C to +155°C
1.0 W
+260°C
See MIL-STD-1835
+150°C 1/
1/ Maximum junction temperature may be increased to +175°C during burn-in and steady state life.
2/ V
IH
is 2.2 V minimum for all input pins except XI which is 3.5 V minimum.
3/ 1.5 V undershoots are allowed for 10 ns once per cycle.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
5962-89568
SHEET
3
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192M-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,
1916 Race Street, Philadelphia, PA 19103).
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-
38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in
the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M
shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
5962-89568
SHEET
4
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required
in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical
parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and
power dissipation, as applicable, in accordance with the intent specified in test method 1015.
(1)
Dynamic burn-in (method 1015 of MIL-STD-883, test condition C or D; for circuit, see 4.2.1b herein).
c. Interim and final electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
5962-89568
SHEET
5
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