10K SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERDIP-16
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | 10K |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.49 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | -5.2 V |
| 最大电源电流（ICC） | 53 mA |
| Prop。Delay @ Nom-Sup | 3.5 ns |
| 传播延迟（tpd） | 5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8779201EA | 10558/BEAJC | 10558M/B2AJC | 5962-87792012A | 5962-8779201FA | |
|---|---|---|---|---|---|
| 描述 | 10K SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERDIP-16 | 10K SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERDIP-16 | 10K SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | 10K SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | 10K SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC | DFP |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DFP, FL16,.3 |
| 针数 | 16 | 16 | 20 | 20 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | 10K | 10K | 10K | 10K | 10K |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.49 mm | 19.495 mm | 8.89 mm | 8.885 mm | 9.65 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 | 20 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | QCCN | QCCN | DFP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LCC20,.35SQ | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| 电源 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| 最大电源电流（ICC） | 53 mA | 53 mA | 53 mA | 53 mA | 53 mA |
| Prop。Delay @ Nom-Sup | 3.5 ns | 5 ns | 5 ns | 3.5 ns | 3.5 ns |
| 传播延迟（tpd） | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | 5.08 mm | 1.9 mm | 1.9 mm | 2.15 mm |
| 表面贴装 | NO | NO | YES | YES | YES |
| 技术 | ECL | ECL | ECL | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 8.89 mm | 8.885 mm | 6.415 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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