ACS30MS
Data Sheet
July 1999
File Number
4759
Radiation Hardened 8-Input NAND Gate
The Radiation Hardened ACS30MS is an 8-Input NAND
Gate. A HIGH level on all inputs results in a LOW level on
the Y output. A LOW level on any input results in a HIGH
level on the Y output. All inputs are buffered and the
outputs are designed for balanced propagation delay and
transition times.
The ACS30MS is fabricated on a CMOS Silicon on
Sapphire (SOS) process, which provides an immunity to
Single Event Latch-up and the capability of highly reliable
performance in any radiation environment. These devices
offer significant power reduction and faster performance
when compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS30MS are
contained in SMD 5962-98631. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/spaceselect.htm
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-Up Free Under Any Conditions
- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10
5
RAD(Si)
- SEU Immunity . . . . . . . . . . . . . <1 x 10
-10
Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm
2
)
• Input Logic Levels. . . . V
IL
= (0.3)(V
CC
), V
IH
= (0.7)(V
CC
)
• Output Current
. . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA
(Min)
• Quiescent Supply Current . . . . . . . . . . . . . . . 5.0µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 16ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
Ordering Information
ORDERING NUMBER
5962F9863101VCC
ACS21D/SAMPLE-03
5962F9863101VXC
ACS21K/SAMPLE-03
5962F9863101V9A
INTERNAL MARKETING
NUMBER
ACS30DMSR-03
ACS30D/SAMPLE-03
ACS30KMSR-03
ACS30K/SAMPLE-03
ACS30HMSR-03
TEMP. RANGE (
o
C)
-55 to 125
25
-55 to 125
25
25
PACKAGE
14 Ld SBDIP
14 Ld SBDIP
14 Ld Flatpack
14 Ld Flatpack
Die
DESIGNATOR
CDIP2-T14
CDIP2-T14
CDFP3-F14
CDFP3-F14
NA
Pinouts
ACS30MS
(SBDIP)
TOP VIEW
A 1
B 2
C 3
D 4
E 5
F 6
GND 7
14 V
CC
13 NC
12 H
11 G
10 NC
9 NC
8 Y
ACS30MS
(FLATPACK)
TOP VIEW
A
B
C
D
E
F
GND
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
CC
NC
H
G
NC
NC
Y
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
ACS30MS
Die Characteristics
DIE DIMENSIONS:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm
±25µm
(20.6 mils
±1
mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
METALLIZATION: AI
Metal 1 Thickness: 0.7µm
±0.1µm
Metal 2 Thickness: 1.0µm
±0.1µm
SUBSTRATE POTENTIAL
Unbiased Insulator
PASSIVATION:
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm
±0.15µm
SPECIAL INSTRUCTIONS
Bond V
CC
First
ADDITIONAL INFORMATION:
Worst Case Current Density: <2.0 x 10
5
A/cm
2
Transistor Count: 86
Metallization Mask Layout
ACS30MS
B
(2)
A
(1)
V
CC
(14)
NC
C (3)
(12) H
D (4)
(11) G
NC
NC
E (5)
NC
(6)
F
(7)
GND
(8)
Y
NC
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
2
PCB设计
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
