ACS244MS
March 1998
Radiation Hardened Non-Inverting,
Octal, Three-State Buffer/Line Driver
Description
The Radiation Hardened ACS244MS is a Non-Inverting,
Octal, Three-State Buffer/Line Driver with two active-LOW
Enable inputs (AE and BE). Each Enable input controls four
outputs. When an Enable input is LOW, the corresponding
outputs are active. A HIGH on an Enable input causes the
corresponding outputs to be high impedance, regardless of
the input levels.
The ACS244MS is fabricated on a CMOS Silicon on Sap-
phire (SOS) process, which provides an immunity to Single
Event Latch-up and the capability of highly reliable perfor-
mance in any radiation environment. These devices offer
significant power reduction and faster performance when
compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS244 are
contained in SMD 5962-98541. A “hot-link” is provided
on our homepage with instructions for downloading.
http://www.intersil.com/data/sm/index.htm
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-up Free Under any Conditions
- Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 10
5
RAD(Si)
- SEU Immunity . . . . . . . . . . . <1 x 10
-10
Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm
2
)
• Input Logic Levels . V
IL
= (0.3V)(V
CC
), V
IH
= (0.7V)(V
CC
)
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . .
±16mA
• Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20µA
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . 9.0ns
Applications
• Databus Driving
• Data Routing
• Redundant Data Control Circuitry
Ordering Information
SMD PART NUMBER
5962F9854101VRC
N/A
5962F9854101VXC
N/A
N/A
INTERSIL PART NUMBER
ACS244DMSR-02
ACS244D/Sample-02
ACS244KMSR-02
ACS244K/Sample-02
ACS244HMSR-02
TEMP. RANGE (
o
C)
-55 to 125
25
-55 to 125
25
25
PACKAGE
20 Ld SBDIP
20 Ld SBDIP
20 Ld Flatpack
20 Ld Flatpack
Die
CASE OUTLINE
CDIP2-T20
CDIP2-T20
CDFP4-F20
CDFP4-F20
N/A
Pinouts
ACS244 (SBDIP)
TOP VIEW
AE
AI1
BO4
AI2
BO3
AI3
BO2
AI4
BO1
1
2
3
4
5
6
7
8
9
20 V
CC
19 BE
18 AO1
17 BI4
16 AO2
15 BI3
14 AO3
13 BI2
12 AO4
11 BI1
AE
AI1
BO4
AI2
BO3
AI3
BO2
AI4
BO1
GND
ACS244 (FLATPACK)
TOP VIEW
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
BE
AO1
BI4
AO2
BI3
AO3
BI2
AO4
BI1
GND 10
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
File Number
4479
1
ACS244MS
Die Characteristics
DIE DIMENSIONS:
Size: 2540µm x 2540µm (100 mils x 100mils)
Thickness: 525µm
±25µm
(20.6 mils
±1
mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
METALLIZATION:
Al
Metal 1 Thickness: 0.7µm
±0.1µm
Metal 2 Thickness: 1.0µm
±0.1µm
SUBSTRATE POTENTIAL:
Unbiased Insulator
PASSIVATION
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm
±0.15µm
SPECIAL INSTRUCTIONS:
Bond V
CC
First
ADDITIONAL INFORMATION:
Worst Case Density: <2.0 x 10
5
A/cm
2
Transistor Count: 214
Metallization Mask Layout
ACS244MS
AI1
(2)
AE
(1)
V
CC
(20)
V
CC
(20)
BE
(19)
(18) AO1
BO4 (3)
(17) BI4
AI2 (4)
(16) AO2
BO3 (5)
(15) BI3
AI3 (6)
(14) AO3
BO2 (7)
(13) BI2
AI4 (8)
BO1 (9)
AO4 (12)
(10) (10)
GND GND
(11)
BI1
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
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