DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, HERMETICALLY SEALED, DIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | M.S. Kennedy Corporation ( Anaren ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8/10,.8,200 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 50 V |
| 最小输入电压 | 12 V |
| 标称输入电压 | 28 V |
| JESD-30 代码 | S-XDMA-P8 |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电流 | 1.82 A |
| 最大输出电压 | 3.63 V |
| 最小输出电压 | 2.97 V |
| 标称输出电压 | 3.3 V |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装等效代码 | DIP8/10,.8,200 |
| 封装形状 | SQUARE |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38534 Class H |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | MILITARY |
| 端子形式 | PIN/PEG |
| 端子节距 | 5.08 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最大总功率输出 | 6 W |
| 微调/可调输出 | YES |
| Base Number Matches | 1 |
| DHC2803SH | DHC2805SE | DHC2803S | DHC2803SE | DHC2803SK | DHC2805SK | |
|---|---|---|---|---|---|---|
| 描述 | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, HERMETICALLY SEALED, DIP-8 | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, HERMETICALLY SEALED, DIP-8 | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, HERMETICALLY SEALED, DIP-8 | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, HERMETICALLY SEALED, DIP-8 | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | M.S. Kennedy Corporation ( Anaren ) | M.S. Kennedy Corporation ( Anaren ) | M.S. Kennedy Corporation ( Anaren ) | M.S. Kennedy Corporation ( Anaren ) | M.S. Kennedy Corporation ( Anaren ) | M.S. Kennedy Corporation ( Anaren ) |
| 包装说明 | DIP, DIP8/10,.8,200 | DIP, DIP8/10,.8,200 | DIP, DIP8/10,.8,200 | DIP, DIP8/10,.8,200 | , | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
| 最小输入电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 标称输入电压 | 28 V | 28 V | 28 V | 28 V | 28 V | 28 V |
| JESD-30 代码 | S-XDMA-P8 | S-XDMA-P8 | S-XDMA-P8 | S-XDMA-P8 | S-XDMA-P8 | S-XDMA-P8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 最大输出电压 | 3.63 V | 5.5 V | 3.63 V | 3.63 V | 3.63 V | 5.5 V |
| 最小输出电压 | 2.97 V | 4.5 V | 2.97 V | 2.97 V | 3.2 V | 4.5 V |
| 标称输出电压 | 3.3 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 5 V |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大总功率输出 | 6 W | 6 W | 6 W | 6 W | 6 W | 6 W |
| 微调/可调输出 | YES | YES | YES | YES | YES | YES |
| 零件包装代码 | DIP | DIP | DIP | DIP | - | - |
| 针数 | 8 | 8 | 8 | 8 | - | - |
| 最大输出电流 | 1.82 A | 1.5 A | 1.82 A | 1.82 A | - | - |
| 封装代码 | DIP | DIP | DIP | DIP | - | - |
| 封装等效代码 | DIP8/10,.8,200 | DIP8/10,.8,200 | DIP8/10,.8,200 | DIP8/10,.8,200 | - | - |
| 端子节距 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
