EDO DRAM, 256KX16, 45ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ALSC [Alliance Semiconductor Corporation] |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, SOJ40,.44 |
| 针数 | 40 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO |
| 最长访问时间 | 45 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J40 |
| JESD-609代码 | e0 |
| 长度 | 26.0985 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | EDO DRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 40 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ40,.44 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 3.76 mm |
| 自我刷新 | YES |
| 最大待机电流 | 0.0002 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| AS4LC256K16E0-45JC | AS4LC256K16E0-60TC | AS4LC256K16E0-35JC | AS4LC256K16E0-45TC | AS4LC256K16E0-60JC | |
|---|---|---|---|---|---|
| 描述 | EDO DRAM, 256KX16, 45ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 | EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, TSOP2-44/40 | EDO DRAM, 256KX16, 35ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 | EDO DRAM, 256KX16, 45ns, CMOS, PDSO40, 0.400 INCH, TSOP2-44/40 | EDO DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
| 零件包装代码 | SOJ | TSOP2 | SOJ | TSOP2 | SOJ |
| 包装说明 | SOJ, SOJ40,.44 | TSOP2, TSOP40/44,.46,32 | SOJ, SOJ40,.44 | TSOP2, TSOP40/44,.46,32 | SOJ, SOJ40,.44 |
| 针数 | 40 | 44 | 40 | 44 | 40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| 最长访问时间 | 45 ns | 60 ns | 35 ns | 45 ns | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-J40 | R-PDSO-G40 | R-PDSO-J40 | R-PDSO-G40 | R-PDSO-J40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 26.0985 mm | 18.41 mm | 26.0985 mm | 18.41 mm | 26.0985 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 40 | 40 | 40 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | TSOP2 | SOJ | TSOP2 | SOJ |
| 封装等效代码 | SOJ40,.44 | TSOP40/44,.46,32 | SOJ40,.44 | TSOP40/44,.46,32 | SOJ40,.44 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 3.76 mm | 1.2 mm | 3.76 mm | 1.2 mm | 3.76 mm |
| 自我刷新 | YES | YES | YES | YES | YES |
| 最大待机电流 | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
| 最大压摆率 | 0.06 mA | 0.05 mA | 0.07 mA | 0.06 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | J BEND | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
| 峰值回流温度（摄氏度） | 225 | 240 | - | 240 | 225 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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