Standard SRAM, 256KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ALSC [Alliance Semiconductor Corporation] |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, QFP100,.63X.87 |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 7.5 ns |
| 其他特性 | FLOW-THROUGH ARCHITECTURE |
| 最大时钟频率 (fCLK) | 117.64 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e0 |
| 长度 | 20 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX32 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2.5/3.3,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.03 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.325 mA |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| AS7C33256FT32A-75TQC | AS7C33256FT36A-85TQIN | AS7C33256FT32A-10TQCN | AS7C33256FT32A-75TQCN | AS7C33256FT32A-75TQIN | AS7C33256FT36A-10TQC | |
|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Standard SRAM, 256KX36, 8.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 256KX32, 10ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 256KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 256KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 256KX36, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 |
| 针数 | 100 | 100 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 7.5 ns | 8.5 ns | 10 ns | 7.5 ns | 7.5 ns | 10 ns |
| 其他特性 | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE |
| 最大时钟频率 (fCLK) | 117.64 MHz | 100 MHz | 83 MHz | 117.64 MHz | 117.64 MHz | 83 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 8388608 bit | 9437184 bit | 8388608 bit | 8388608 bit | 8388608 bit | 9437184 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 32 | 36 | 32 | 32 | 32 | 36 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 组织 | 256KX32 | 256KX36 | 256KX32 | 256KX32 | 256KX32 | 256KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 245 | 250 | 245 | 245 | NOT SPECIFIED |
| 电源 | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大待机电流 | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 0.325 mA | 0.3 mA | 0.3 mA | 0.325 mA | 0.325 mA | 0.3 mA |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 40 | 30 | 30 | NOT SPECIFIED |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | - |
| JESD-609代码 | e0 | e3 | - | e3 | e3 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | MATTE TIN | - | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
