REVISIONS
LTR
A
B
C
D
E
F
G
H
J
K
L
DESCRIPTION
Added device types 03 and 04. Technical changes to 1.3 and table I.
Changes to table III, and changes to reflect MIL-H-38534 processing.
Editorial changes throughout.
Made correction to the lead length on figure 2 for case outline Y. Editorial
changes throughout.
Add case outline Z. Make technical changes to table I. Change
dimensions for case outlines X and Y. Make technical changes to figure 2,
terminal connections. Editorial changes throughout.
Add case outline T. Make changes to paragraph 1.4. Make technical
changes to table I. Changed package height for case outline X from .25
inches to .20 inches. Made corrections to the terminal connections.
Changes in accordance with NOR 5962-R077-94.
Changes in accordance with NOR 5962-R036-95.
Changes in accordance with NOR 5962-R119-95.
Correct case outline T package height dimension from .150 inches to .145
inches. Make changes to table I.
Figure 1, create individual diagrams for case outlines T and Y.
Table I, device type 03, correct maximum limits for I
CC2
and I
CC3
.
Add Vendor Cage code 88379. Figure 1, case outline Y, change
dimension A max. from .186" to .225". Figure 1, case outline X, correct
dimension L, min. from .024" to .240" and Max. from .026" to .260". Figure
2, terminal connections for device types 01 through 03, case outlines Y and
T, correct pin 39 to TX/RX-B and pin 40 to TX/RX-B.
Added device type 05. Paragraph 1.3, corrected the power dissipation
from"120 mW" to "1.8 W" for device type 03. Table I; Added footnote 17 to
the following tests: I
CC2
, I
CC3
, I
EE2
, V
OVRSHT
, t
PW1
, t
PW2
, t
PW3
, and t
r
. Removed
footnote 17 from the Output Offset Voltage (V
OS
) test. Added footnote 15
to the I
IL1
test. Corrected the unit for the tests t
r
and t
Z
from "ns" to "μs".
Updated drawing paragraphs. -sld
DATE (YR-MO-DA)
90-10-10
91-11-25
93-03-10
93-07-27
93-12-22
94-11-16
95-04-27
97-03-04
00-07-18
00-08-28
06-04-13
APPROVED
G. Lude
G. Lude
K. Cottongim
K. Cottongim
K. Cottongim
K. Cottongim
K. Cottongim
K. A. Cottongim
Raymond Monnin
Raymond Monnin
Raymond Monnin
M
12-06-04
Charles F. Saffle
REV
SHEET
REV
SHEET
OF SHEETS
PMIC N/A
M
15
M
16
M
17
M
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
M
19
M
20
M
21
M
1
M
22
M
2
M
23
M
3
M
24
M
4
M
25
M
5
M
26
M
6
M
27
M
7
M
28
M
8
M
29
M
9
M
30
M
10
M
31
M
11
M
32
M
12
M
13
M
14
REV STATUS
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF
DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
APPROVED BY
Gregory A. Lude
DRAWING APPROVAL DATE
89-06-02
MICROCIRCUIT, HYBRID, LINEAR,
MIL-STD-1553, BC/RTU/MT, MULTIPLEXED
TERMINAL
REVISION LEVEL
M
SIZE
A
SHEET
CAGE CODE
67268
1 OF
32
5962-88692
DSCC FORM 2233
APR 97
5962-E041-12
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
5962-88692
ô
ô
ô
Drawing number
01
ô
ô
ô
Device type
(see 1.2.1)
X
ô
ô
ô
Case outline
(see 1.2.2)
A
ô
ô
ô
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
Generic number
BUS61553, BUS61563, CT2553
BUS61554, BUS61564, CT2554
BUS61555, BUS61565, CT2555
BUS61556
CT2555-003
Circuit function
MIL-STD-1553, BC/RTU/MT, transceiver multiplexed terminal
MIL-STD-1553, BC/RTU/MT, transceiver multiplexed terminal
MIL-STD-1553, BC/RTU/MT, transceiver multiplexed terminal
MIL-STD-1553, BC/RTU/MT, transceiverless multiplexed terminal
MIL-STD-1553, BC/RTU/MT, transceiver, multiplexed terminal
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
T
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
82
78
82
78
Package style
Flat pack
Dual-in-line
Flat pack
Flat pack
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range:
V
CC
(device types 01 through 03 and 05) ...............................
V
EE
(device types 01 and 02)..................................................
Logic input voltage range (V
DD
)..................................................
Power dissipation (P
D
): 2/ 3/
Device types 01 and 02 ..........................................................
Device type 03........................................................................
Device type 04........................................................................
Device type 05........................................................................
Storage temperature range ........................................................
Lead temperature (soldering, 10 seconds) ................................
Thermal resistance, junction-to-case (q
JC
): 3/
Devices types 01 and 02 ........................................................
Device type 03........................................................................
Device type 04........................................................................
Device type 05........................................................................
1/
2/
3/
-0.5 V dc to +7.0 V dc
+0.3 V dc to -18 V dc
-0.5 V dc to +7.0 V dc
810 mW
1.8 W
100 mW
1.2 W
-65°C to +150°C
+300°C
5.7°C/W
112°C/W
11.6°C/W
13°C/W
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum
levels may degrade performance and affect reliability.
Applies up to T
C
= +125°C.
Hottest die
.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88692
SHEET
M
2
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage range:
V
CC
(device types 01 and 02) .................................................
V
CC
(device types 03 and 05) .................................................
V
EE
(device type 01) ...............................................................
V
EE
(device type 02) ...............................................................
Logic input voltage range:
V
DD
(device types 01, 02, and 04) ..........................................
V
DD
(device types 03 and 05) .................................................
Minimum logic high input voltage (V
IH
) .......................................
Maximum logic low input voltage (V
IL
)........................................
Operating frequency (F
OP
) .........................................................
Case operating temperature range (T
C
) .....................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
+4.5 V dc to +5.5 V dc
+4.75 V dc to +5.5 V dc
-14.25 V dc to -15.75 V dc
-11.40 V dc to -12.60 V dc
+4.5 V dc to +5.5 V dc
+4.75 V dc to +5.5 V dc
2.2 V dc
0.8 V dc
16.0 MHz
-55°C to +125°C
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-
PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may
eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-
38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or
function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88692
SHEET
M
3
DSCC FORM 2234
APR 97
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram(s). The block diagram(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in method 1015 of MIL-STD-883.
T
A
as specified in accordance with table I of method 1015 of MIL-STD-883.
(2)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88692
SHEET
M
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
£
T
C
£
+125°C
unless otherwise specified
Group A
subgroups
Device
type
Min
Limits
Unit
Max
170
170
60
170
170
170
170
-80
mA
mA
mA
Logic supply current, idle 2/
I
DD
Positive supply current,
idle
3/
I
CC1
V
CC
= 5.5 V, V
DD
= 5.5 V
V
EE
= -15 V for device 01,
V
EE
= -12 V for device 02.
I
OL1
= 3.6 mA,
I
OH1
= -400
mA,
I
OL2
= 2.0 mA,
I
OL3
= 4.0 mA,
f
IN
= 16 MHz
1,2,3
01,02
03
04
05
5.0
50.0
5.0
40.0
5.0
50.0
40.0
-5.0
1,2,3
01,02
03
05
Negative supply current,
idle
Positive supply current,
channel A = 25 percent
duty cycle,
Channel B = idle 3/ 17/
4/
I
EE1
I
CC2
1,2,3
01,02
1,2,3
01,02
03
05
5.0
50.0
40.0
5.0
50.0
40.0
-25
170
250
250
170
250
250
-130
mA
Positive supply current,
channel B = 25 percent
duty cycle,
Channel A = idle 3/ 17/
I
CC3
1,2,3
01,02
03
05
mA
Negative supply current,
channel A = 25 percent
duty cycle,
Channel B = idle 4/ 17/
Negative supply current,
channel B = 25 percent
duty cycle,
Channel A = idle 4/ 17/
High level output voltage 5/
I
EE2
1,2,3
01,02
mA
I
EE2
1,2,3
01,02
-25
-130
mA
V
OH
V
CC
= 4.5 V, V
DD
= 4.5 V,
V
IH
= 2.7 V, V
IL
= 0.4 V,
V
EE
= -15 V for device 01,
V
EE
= -12 V for device 02,
I
OH
= -400
mA
6/
1,2,3
All
2
V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-88692
SHEET
M
5
DSCC FORM 2234
APR 97
Microchip MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
