ZBT SRAM, 64KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | QFP |
包装说明 | LQFP, |
针数 | 100 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 7.5 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 |
JESD-609代码 | e0 |
长度 | 20 mm |
内存密度 | 2097152 bit |
内存集成电路类型 | ZBT SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX32 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 3.465 V |
最小供电电压 (Vsup) | 3.135 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
Base Number Matches | 1 |
AS7C3364NTF32B-75TQI | AS7C3364NTF32B-75TQC | AS7C3364NTF32B-80TQC | AS7C3364NTF32B-80TQI | AS7C3364NTF36B-10TQI | AS7C3364NTF36B-75TQC | AS7C3364NTF36B-75TQI | AS7C3364NTF36B-80TQC | AS7C3364NTF36B-80TQI | AS7C3364NTF32B-10TQC | |
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描述 | ZBT SRAM, 64KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX36, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 64KX32, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 7.5 ns | 7.5 ns | 8 ns | 8 ns | 10 ns | 7.5 ns | 7.5 ns | 8 ns | 8 ns | 10 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2097152 bit |
内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
内存宽度 | 32 | 32 | 32 | 32 | 36 | 36 | 36 | 36 | 36 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
组织 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX36 | 64KX36 | 64KX36 | 64KX36 | 64KX36 | 64KX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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