512MB Fully Buffered DIMM
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ELPIDA |
零件包装代码 | DIMM |
包装说明 | DIMM, DIMM240,40 |
针数 | 240 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 267 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N240 |
内存密度 | 4831838208 bi |
内存集成电路类型 | DRAM MODULE |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 240 |
字数 | 67108864 words |
字数代码 | 64000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | |
组织 | 64MX72 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM240,40 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 1.5,1.8 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
自我刷新 | YES |
最大压摆率 | 3.4 mA |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | NO LEAD |
端子节距 | 1 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
EBE51FD8AHFL-5C-E | EBE51FD8AHFT-6E-E | EBE51FD8AHFT | EBE51FD8AHFT-5C-E | EBE51FD8AHFE-6E-E | EBE51FD8AHFE | EBE51FD8AHFL | EBE51FD8AHFE-5C-E | |
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描述 | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM |
厂商名称 | ELPIDA | ELPIDA | - | ELPIDA | ELPIDA | - | - | ELPIDA |
零件包装代码 | DIMM | DIMM | - | DIMM | DIMM | - | - | DIMM |
包装说明 | DIMM, DIMM240,40 | DIMM, | - | DIMM, DIMM240,40 | DIMM, | - | - | DIMM, DIMM240,40 |
针数 | 240 | 240 | - | 240 | 240 | - | - | 240 |
Reach Compliance Code | unknow | unknown | - | unknow | unknow | - | - | unknow |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | - | - | EAR99 |
访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | - | - | SINGLE BANK PAGE BURST |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N240 | R-XDMA-N240 | - | R-XDMA-N240 | R-XDMA-N240 | - | - | R-XDMA-N240 |
内存密度 | 4831838208 bi | 4831838208 bit | - | 4831838208 bi | 4831838208 bi | - | - | 4831838208 bi |
内存集成电路类型 | DRAM MODULE | DRAM MODULE | - | DRAM MODULE | DRAM MODULE | - | - | DRAM MODULE |
内存宽度 | 72 | 72 | - | 72 | 72 | - | - | 72 |
功能数量 | 1 | 1 | - | 1 | 1 | - | - | 1 |
端口数量 | 1 | 1 | - | 1 | 1 | - | - | 1 |
端子数量 | 240 | 240 | - | 240 | 240 | - | - | 240 |
字数 | 67108864 words | 67108864 words | - | 67108864 words | 67108864 words | - | - | 67108864 words |
字数代码 | 64000000 | 64000000 | - | 64000000 | 64000000 | - | - | 64000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS |
组织 | 64MX72 | 64MX72 | - | 64MX72 | 64MX72 | - | - | 64MX72 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | - | UNSPECIFIED |
封装代码 | DIMM | DIMM | - | DIMM | DIMM | - | - | DIMM |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | - | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | - | Not Qualified |
自我刷新 | YES | YES | - | YES | YES | - | - | YES |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | - | 1.9 V | 1.9 V | - | - | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | - | - | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | - | - | 1.8 V |
表面贴装 | NO | NO | - | NO | NO | - | - | NO |
技术 | CMOS | CMOS | - | CMOS | CMOS | - | - | CMOS |
端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | - | - | NO LEAD |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | - | - | DUAL |
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