Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168
参数名称 | 属性值 |
厂商名称 | LG Semicon Co Ltd |
包装说明 | DIMM, DIMM168 |
Reach Compliance Code | unknown |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 133 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N168 |
内存密度 | 2147483648 bit |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
内存宽度 | 64 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 168 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32MX64 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM168 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
自我刷新 | YES |
最大待机电流 | 0.016 A |
最大压摆率 | 1.9 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
GMM26433233ANTG-75 | GMM26433233ANTG-7K | GMM26433233ANTG-7J | GMM26433233ANTG-8 | GMM26433233ANTG-10K | |
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描述 | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 32MX64, 8ns, CMOS, DIMM-168 |
厂商名称 | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd | LG Semicon Co Ltd |
包装说明 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns | 6 ns | 6 ns | 6 ns | 8 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 133 MHz | 100 MHz | 100 MHz | 125 MHz | 100 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
内存密度 | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
内存宽度 | 64 | 64 | 64 | 64 | 64 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 168 | 168 | 168 | 168 | 168 |
字数 | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
字数代码 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 32MX64 | 32MX64 | 32MX64 | 32MX64 | 32MX64 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 |
自我刷新 | YES | YES | YES | YES | YES |
最大待机电流 | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
最大压摆率 | 1.9 mA | 1.8 mA | 1.8 mA | 1.9 mA | 1.6 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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