Memory Circuit, 128KX16, CMOS, CQMA68, HERMETIC SEALED, CERAMIC, QFP-68
| 参数名称 | 属性值 |
| 厂商名称 | Cobham Semiconductor Solutions |
| 零件包装代码 | QMA |
| 包装说明 | , |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| 其他特性 | 128K X 16 SRAM ALSO AVAILABLE |
| JESD-30 代码 | S-CQMA-G68 |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 128KX16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | SQUARE |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| ACT-SF128K16N-26F18Q | ACT-SF128K16N-26P3Q | ACT-SF128K16N-39F18Q | ACT-SF128K16N-39P3Q | ACT-SF128K16N-39P7Q | ACT-SF128K16N-37P3Q | ACT-SF128K16N-37F18Q | ACT-SF128K16N-26P7Q | ACT-SF128K16N-37P7Q | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 128KX16, CMOS, CQMA68, HERMETIC SEALED, CERAMIC, QFP-68 | Memory Circuit, 128KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 | Memory Circuit, 128KX16, CMOS, CQMA68, HERMETIC SEALED, CERAMIC, QFP-68 | Memory Circuit, 128KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 | Memory Circuit, 128KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 | Memory Circuit, 128KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 | Memory Circuit, 128KX16, CMOS, CQMA68, HERMETIC SEALED, CERAMIC, QFP-68 | Memory Circuit, 128KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 | Memory Circuit, 128KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 |
| 厂商名称 | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
| 零件包装代码 | QMA | PGA | QMA | PGA | PGA | PGA | QMA | PGA | PGA |
| 包装说明 | , | PGA, | , | PGA, | PGA, | PGA, | , | PGA, | PGA, |
| 针数 | 68 | 66 | 68 | 66 | 66 | 66 | 68 | 66 | 66 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE | 128K X 16 SRAM ALSO AVAILABLE |
| JESD-30 代码 | S-CQMA-G68 | S-CPGA-P66 | S-CQMA-G68 | S-CPGA-P66 | S-CPGA-P66 | S-CPGA-P66 | S-CQMA-G68 | S-CPGA-P66 | S-CPGA-P66 |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 66 | 68 | 66 | 66 | 66 | 68 | 66 | 66 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | MICROELECTRONIC ASSEMBLY | GRID ARRAY | MICROELECTRONIC ASSEMBLY | GRID ARRAY | GRID ARRAY | GRID ARRAY | MICROELECTRONIC ASSEMBLY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | PIN/PEG | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG | GULL WING | PIN/PEG | PIN/PEG |
| 端子位置 | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 封装代码 | - | PGA | - | PGA | PGA | PGA | - | PGA | PGA |
| 座面最大高度 | - | 4.064 mm | - | 4.064 mm | 4.699 mm | 4.064 mm | - | 4.699 mm | 4.699 mm |
| 端子节距 | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
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