REVISIONS
LTR
A
DESCRIPTION
Add packages T and W. Add vendor CAGE 60395 as source of
supply. Increase data retention to 20 years, minimum. Redrawn with
changes.
Changes in accordance with NOR 5962-R139-94.
Changes in accordance with NOR 5962-R278-94.
Changes in accordance with NOR 5962-R163-96.
Updated boilerplate. Added device types 16-18 and packages M and N
to drawing along with vendor CAGE 0EU86 as supplier. Removed
figures 9, 10 and 11 software data protect algorithms. Removed
vendor 61395 as supplier. - glg
Corrected dimensions for packages "M" and "N". - glg
Added device 19, packages 6 and 7, and updated boilerplate. ksr
DATE
(YR-MO-DA)
93-06-29
APPROVED
M. A. Frye
B
C
D
E
94-03-29
94-09-19
96-06-27
98-07-22
M. A. Frye
M. A. Frye
M. A. Frye
Raymond Monnin
F
G
99-10-06
01- 10- 05
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
G
35
G
15
G
36
G
16
G
37
G
17
G
18
G
19
G
20
G
21
G
1
G
22
G
2
G
23
G
3
G
24
G
4
G
25
G
5
G
26
G
6
G
27
G
7
G
28
G
8
G
29
G
9
G
30
G
10
G
31
G
11
G
32
G
12
G
33
G
13
G
34
G
14
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Charles Reusing
PMIC N/A
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
APPROVED BY
Charles E. Besore
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS 128K x 8 BIT EEPROM,
MONOLITHIC SILICON
SIZE
A
SHEET
DRAWING APPROVAL DATE
91-07-12
REVISION LEVEL
G
CAGE CODE
67268
1
OF
37
5962-38267
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E561-01
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
|
|
|
Federal
stock class
designator
\
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Software
data
protect
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
-
|
|
|
RHA
designator
(see 1.2.1)
38267
01
|
|
|
Device
type
(see 1.2.2)
/
Q
|
|
|
Device
class
designator
(see 1.2.3)
X
|
|
|
Case
outline
(see 1.2.4)
X
|
|
|
Lead
finish
(see 1.2.5)
Device type
01,16
02
03,17
04
05,18
06
07,19
08
09
10
11
12
13
14
15
Generic
number
1/
Circuit function
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
128K x 8 EEPROM
Access time
250 ns
250 ns
200 ns
200 ns
150 ns
150 ns
120 ns
120 ns
90 ns
90 ns
70 ns
70 ns
120 ns
90 ns
70 ns
Write speed
10 ms
5 ms
10 ms
5 ms
10 ms
5 ms
10 ms
3 ms
10 ms
3 ms
10 ms
3 ms
3 ms
3 ms
3 ms
Write mode
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Byte/Page
Endurance
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
10,000 cycle
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will
also be listed in QML-38535 and MIL-HDBK-103.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-38267
SHEET
2
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
W
M
N
6
7
Descriptive designator
GDIP1-T32 or CDIP2-T32
CQCC1-N44
See figure 1
CQCC1-N32
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1(enhanced rad tolerant)
See figure 1(enhanced rad tolerant)
Terminals
32
44
32
32
30
36
32
32
32
32
Package style
Dual in-line
Square chip carrier
Flat package
Rectangular chip carrier
Grid array
Grid array
Flat package
Flat package
Flat package
Flat package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . .
Thermal resistance, junction-to-case (
JC):
Cases X, Y and U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cases T and W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended operating conditions.
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High level input voltage range (VIH) . . . . . . . . . . . . . . . . . . . . . .
Low level input voltage range (VIL) . . . . . . . . . . . . . . . . . . . . . .
Case operating temperature range (TC) . . . . . . . . . . . . . . . . . .
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . .
100 percent
4.5 V dc minimum to 5.5 V dc maximum
0.0 V dc
2.0 V dc to VCC + 1.0 V dc 6/
-0.1 V dc to 0.8 V dc
-55
(
C to +125
(
C
-0.5 V dc to +6.0 V dc 3/
-55
(
C to +125
(
C
-65
(
C to +150
(
C
+300
(
C
See MIL-STD-1835
21
(
C/W 4/
18
(
C/W 4/
3
(
C/W 4/
2
(
C/W 4/
1.5
(
C/W 4/
1.5
(
C/W 4/
1.0 watts
+175
(
C 5/
10,000 cycles/byte (minimum)
20 years minimum
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ All voltages referenced to VSS (VSS = ground), unless otherwise specified.
3/ Negative undershoots to a minimum of -1.0 V are allowed with a maximum of 20 ns pulse width.
4/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede
the value indicated herein.
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with method 5004 of MIL-STD-883.
6/ For device types 16-19 only, VIH on R
shall be VCC - 0.5 V min. to VCC + 1.0 V max.
E S
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-38267
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard for Microcircuit Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless
otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the
solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited
in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-88
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials, 1916
Race Street, Philadelphia, PA 19103).
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78 - I/C Latch-up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,
VA 22201).
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-38267
SHEET
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535
and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in
accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 3 herein. When required, in screening (see 4.2 herein), or quality conformance inspection groups
A, B, C, or D (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test in a checkerboard or similar
pattern (a minimum of 50 percent of the total number of bits programmed).
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this document.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case
operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations,
the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class
M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance.
For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2
herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall
affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for
device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)
involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-38267
SHEET
5
NXP MCU
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