BZW03D...
Silicon Z–Diodes and Transient Voltage Suppressors
Features
D
Glass passivated junction
D
Hermetically sealed package
D
Clamping sealed package
Applications
Voltage regulators and transient suppression circuits
94 9588
Absolute Maximum Ratings
T
j
= 25
_
C
Parameter
Power dissipation
Power dissipation
Repetitive peak reverse power
dissipation
Non repetitive peak surge power
dissipation
Junction temperature
Storage temperature range
Test Conditions
l=10mm,
T
L
=25
°
C
T
amb
=45
°
C
Type
Symbol
P
V
P
V
P
ZRM
t
p
=100
m
s,
T
j
=25
°
C
P
ZSM
T
j
T
stg
Value
6.0
1.85
20
1000
175
–65...+175
Unit
W
W
W
W
°
C
°
C
Maximum Thermal Resistance
T
j
= 25
_
C
Parameter
Junction ambient
Junction ambient
Test Conditions
l=25mm, T
L
=constant
on PC board with spacing 37.5mm
Symbol
R
thJA
R
thJA
Value
30
70
Unit
K/W
K/W
Characteristics
T
j
= 25
_
C
Parameter
Forward voltage
Test Conditions
I
F
=1A
Type
Symbol
V
F
Min
Typ
Max
1.2
Unit
V
TELEFUNKEN Semiconductors
Rev. A1, 12-Dec-94
1 (5)
BZW03D...
Characteristics when used as transient suppressor diodes, T
j
= 25°C
Type
BZW03D...
7V5
8V2
9V1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
1)
I
R1)
at V
R
m
A
V
3000
5.8
2400
6.5
100
7.1
40
7.9
30
8.6
20
9.3
10
10.6
10
11.6
10
12.6
10
14.4
10
15.8
10
17.2
10
19.4
10
21.5
10
23.5
10
25.8
10
28
10
31
10
33.5
V
(BR) 2)
V
11.7
12.6
13.6
15.2
16.2
17.5
19.1
21.8
23.4
26.3
29.2
32
34.6
39
43.2
47
51,7
56
62
I
(BR)S
A
44.2
40.6
37.6
34.0
31.8
29.4
26.4
23.9
21.8
19.5
17.6
16.1
14.8
13.1
11.8
10.8
10.0
9.2
8.2
2)
Type
BZW03D...
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
I
R1)
at V
R
m
A
V
10
36.5
10
40
10
44.5
10
49
10
54
10
59
10
65
10
71
10
79
10
86
10
93
10
106
10
116
10
126
10
144
10
158
10
172
10
194
10
215
V
(BR) 2)
V
66.7
73
80.2
88.7
97.2
107
117
130
143
157
172
187
213
229
256
284
314
344
388
I
(BR)S
A
7.6
7.0
6.3
5.8
5.3
4.8
4.3
3.9
3.6
3.3
3.0
2.7
2.4
2.2
2.0
1.8
1.6
1.5
1.3
Stand-off reverse voltage =
recommended supply voltage
Exp. falling pulse t
p
= 500
m
s down to 37%
Typical Characteristics
(T
j
= 25
_
C unless otherwise specified)
50
3
P
tot
– Total Power Dissipation ( W )
8
l
l=10mm
6
15mm
4
20mm
T
L
=constant
l
37.5
50
2
see Fig.1
0
0
40
80
120
160
200
7
2
94 9087
95 9608
T
amb
– Ambient Temperature (
°C
)
Figure 1. Epoxy glass hard tissue, board thickness 1.5 mm,
R
thJA
70 K/W
x
Figure 2. Total Power Dissipation vs. Ambient Temperature
TELEFUNKEN Semiconductors
Rev. A1, 12-Dec-94
3 (5)
BZW03D...
Ozone Depleting Substances Policy Statement
It is the policy of
TEMIC TELEFUNKEN microelectronic GmbH
to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH
semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC
can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A1, 12-Dec-94
5 (5)
FPGA/CPLD
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