10H SERIES, TRIPLE 3-INPUT OR/NOR GATE, CDIP16, CERDIP-16
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | ASYMMETRICAL INPUTS |
| 系列 | 10H |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.49 mm |
| 逻辑集成电路类型 | OR/NOR GATE |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | -5.2 V |
| 最大电源电流（ICC） | 23 mA |
| 传播延迟（tpd） | 1.6 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8750701EA | GRM0222C1E8R9CA03 | 10H505/BFAJC | 5962-8750701FA | 5962-87507012A | |
|---|---|---|---|---|---|
| 描述 | 10H SERIES, TRIPLE 3-INPUT OR/NOR GATE, CDIP16, CERDIP-16 | Chip Multilayer Ceramic Capacitors for General Purpose | 10H SERIES, TRIPLE 3-INPUT OR/NOR GATE, CDFP16, CERAMIC, FP-16 | 10H SERIES, TRIPLE 3-INPUT OR/NOR GATE, CDFP16, CERAMIC, FP-16 | 10H SERIES, TRIPLE 3-INPUT OR/NOR GATE, CQCC20, CERAMIC, LCC-20 |
| 零件包装代码 | DIP | - | DFP | DFP | QLCC |
| 包装说明 | DIP, DIP16,.3 | - | DFP, FL16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| 针数 | 16 | - | 16 | 16 | 20 |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown |
| 其他特性 | ASYMMETRICAL INPUTS | - | ASYMMETRICAL INPUTS | ASYMMETRICAL INPUTS | ASYMMETRICAL INPUTS |
| 系列 | 10H | - | 10H | 10H | 10H |
| JESD-30 代码 | R-GDIP-T16 | - | R-GDFP-F16 | R-GDFP-F16 | S-CQCC-N20 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 长度 | 19.49 mm | - | 9.65 mm | 9.65 mm | 8.885 mm |
| 逻辑集成电路类型 | OR/NOR GATE | - | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE |
| 功能数量 | 3 | - | 3 | 3 | 3 |
| 输入次数 | 3 | - | 3 | 3 | 3 |
| 端子数量 | 16 | - | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | - | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | - | DFP | DFP | QCCN |
| 封装等效代码 | DIP16,.3 | - | FL16,.3 | FL16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | - | FLATPACK | FLATPACK | CHIP CARRIER |
| 电源 | -5.2 V | - | -5.2 V | -5.2 V | -5.2 V |
| 最大电源电流（ICC） | 23 mA | - | 23 mA | 23 mA | 23 mA |
| 传播延迟（tpd） | 1.6 ns | - | 1.6 ns | 1.6 ns | 1.6 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | - | NO | NO | NO |
| 筛选级别 | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | - | 2.15 mm | 2.15 mm | 1.9 mm |
| 表面贴装 | NO | - | YES | YES | YES |
| 技术 | ECL | - | ECL | ECL | ECL |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | FLAT | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | - | 6.415 mm | 6.415 mm | 8.885 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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