GD74HCT368概述

Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16,

GD74HCT368规格参数

参数名称	属性值
是否Rohs认证	不符合
包装说明	DIP, DIP16,.3
Reach Compliance Code	unknown
控制类型	ENABLE LOW
JESD-30 代码	R-PDIP-T16
JESD-609代码	e0
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.006 A
位数	6
功能数量	2
端子数量	16
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	INVERTED
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP16,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	5 V
Prop。Delay @ Nom-Sup	26 ns
认证状态	Not Qualified
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
Base Number Matches	1

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GD74HCT368相似产品对比

	GD74HCT368	GD74HCT368J	GD74HCT368D	GD74HC368D	GD54HCT368J	GD54HC368J	GD74HC368J	GD74HC368
描述	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDSO16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDSO16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16,	Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16,
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
控制类型	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
JESD-30 代码	R-PDIP-T16	R-XDIP-T16	R-PDSO-G16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
最大I（ol）	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A
位数	6	6	6	6	6	6	6	6
功能数量	2	2	2	2	2	2	2	2
端子数量	16	16	16	16	16	16	16	16
最高工作温度	85 °C	85 °C	85 °C	85 °C	125 °C	125 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
封装代码	DIP	DIP	SOP	SOP	DIP	DIP	DIP	DIP
封装等效代码	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
电源	5 V	5 V	5 V	2/6 V	5 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	26 ns	26 ns	26 ns	23 ns	30 ns	38 ns	23 ns	23 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	NO	NO	YES	YES	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	-	DIP, DIP16,.3
厂商名称	-	-	-	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd	LG Semicon Co Ltd

GD74HCT368

GD74HCT368概述

GD74HCT368规格参数

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