BUK7C08-55AITE
TrenchPLUS standard level FET
M3D323
Rev. 01 — 19 August 2003
Product data
1. Product profile
1.1 Description
N-channel enhancement mode field-effect power transistor in a plastic package using
TrenchMOS™ technology, featuring very low on-state resistance and including
TrenchPLUS current sensing, and diodes for ESD and overtemperature protection.
Product availability:
BUK7C08-55AITE in SOT427 (D
2
-PAK).
1.2 Features
s
Q101 compliant
s
ESD protection
s
Integrated temperature sensor
s
Integrated current sensor.
1.3 Applications
s
Variable Valve Timing for engines
s
Automotive and power switching
s
Electrical Power Assisted Steering
s
Fan control.
1.4 Quick reference data
s
V
DS
≤
55 V
s
I
D
≤
130 A
s
R
DSon
= 6.8 mΩ (typ)
s
V
F
= 658 mV (typ)
s
S
F
=
−1.54
mV/K (typ)
s
I
D
/I
sense
= 500 (typ).
2. Pinning information
Table 1:
Pin
1
2
3
4
mb
Pinning - SOT427, simplified outline and symbol
Description
gate (g)
I
sense
anode (a)
drain (d)
mounting base;
connected to
drain (d)
Pin
5
6
7
Description
cathode (k)
d
a
Simplified outline
Symbol
Kelvin source
source (s)
1 2 3 4 5 6 7
mb
g
Front view
MBK128
MBL362
Isense
s
k
Kelvin source
SOT427 (D
2
-PAK)
Philips Semiconductors
BUK7C08-55AITE
TrenchPLUS standard level FET
3. Limiting values
Table 2: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
V
DGR
V
GS
I
D
Parameter
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
T
mb
= 25
°C;
V
GS
= 10 V;
Figure 2
and
3
T
mb
= 100
°C;
V
GS
= 10 V;
Figure 2
I
DM
P
tot
I
GS(CL)
peak drain current
total power dissipation
gate-source clamping current
T
mb
= 25
°C;
pulsed; t
p
≤
10
µs;
Figure 3
T
mb
= 25
°C;
Figure 1
continuous
t
p
= 5 ms;
δ
= 0.01
V
isol(FET-TSD)
FET to temperature sense diode
isolation voltage
T
stg
T
j
I
DR
I
DRM
E
DS(AL)S
storage temperature
junction temperature
reverse drain current (DC)
peak reverse drain current
non-repetitive avalanche energy
T
mb
= 25
°C
T
mb
= 25
°C;
pulsed; t
p
≤
10
µs
unclamped inductive load; I
D
= 75 A;
V
DS
≤
55 V; V
GS
= 10 V;
R
GS
= 50
Ω;
starting T
j
= 25
°C
[1]
[2]
[1]
[2]
[2]
Conditions
R
GS
= 20 kΩ
Min
-
-
-
-
-
-
-
-
-
-
-
−55
−55
-
-
-
-
Max
55
55
±20
130
75
75
522
272
10
50
±100
+175
+175
130
75
522
460
Unit
V
V
V
A
A
A
A
W
mA
mA
V
°C
°C
A
A
A
mJ
Source-drain diode
Avalanche ruggedness
Electrostatic discharge
V
esd
electrostatic discharge voltage, pins Human Body Model; C = 100 pF;
1,2,4,6,7
R = 1.5 kΩ
-
6
kV
[1]
[2]
Current is limited by power dissipation chip rating.
Continuous current is limited by package.
9397 750 11696
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 01 — 19 August 2003
2 of 15
Philips Semiconductors
BUK7C08-55AITE
TrenchPLUS standard level FET
120
Pder
(%)
80
03na19
150
ID
(A)
03no05
100
40
50
Capped at 75A due to package
0
0
50
100
150
200
Tmb
(°C)
0
0
50
100
150
Tj (°C)
200
P
tot
P
der
=
----------------------
×
100%
-
P
°
tot
(
25 C
)
V
GS
≥
10 V
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
Fig 2. Continuous drain current as a function of
mounting base temperature.
103
ID
(A)
03nh48
RDSon = VDS / ID
tp = 10 µs
102
100 µs
Capped at 75 A due to package
1 ms
DC
10
10 ms
100 ms
1
1
10
VDS (V)
102
T
mb
= 25
°C;
I
DM
single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
9397 750 11696
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 01 — 19 August 2003
3 of 15
Philips Semiconductors
BUK7C08-55AITE
TrenchPLUS standard level FET
4. Thermal characteristics
Table 3:
Symbol
R
th(j-a)
R
th(j-mb)
Thermal characteristics
Parameter
thermal resistance from junction to
ambient
thermal resistance from junction to
mounting base
Conditions
mounted on printed circuit board;
minimum footprint
Figure 4
Min
-
-
Typ
-
-
Max
50
0.55
Unit
K/W
K/W
4.1 Transient thermal impedance
1
Z
th(j-mb)
(K/W)
03ni29
δ
= 0.5
10-1
0.2
0.1
0.05
10-2
0.02
P
single shot
δ
=
tp
T
tp
T
t
10-3
10-6
10-5
10-4
10-3
10-2
10-1
1
tp (s)
10
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
9397 750 11696
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 01 — 19 August 2003
4 of 15
Philips Semiconductors
BUK7C08-55AITE
TrenchPLUS standard level FET
5. Characteristics
Table 4: Characteristics
T
j
= 25
°
C unless otherwise specified.
Symbol
V
(BR)DSS
Parameter
drain-source breakdown
voltage
Conditions
I
D
= 0.25 mA; V
GS
= 0 V
T
j
= 25
°C
T
j
=
−55 °C
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
= V
GS
;
Figure 9
T
j
= 25
°C
T
j
= 175
°C
T
j
=
−55 °C
I
DSS
drain-source leakage current
V
DS
= 40 V; V
GS
= 0 V
T
j
= 25
°C
T
j
= 175
°C
V
(BR)GSS
I
GSS
gate-source breakdown
voltage
gate-source leakage current
I
G
=
±1
mA;
−55 °C
< T
j
< +175
°C
V
GS
=
±10
V; V
DS
= 0 V
T
j
= 25
°C
T
j
= 175
°C
R
DSon
drain-source on-state
resistance
V
GS
= 10 V; I
D
= 50 A;
Figure 7
and
8
T
j
= 25
°C
T
j
= 175
°C
R
D(Is)on
drain-I
sense
on-state
resistance
V
GS
= 10 V; I
D
= 25 mA;
Figure 18
T
j
= 25
°C
T
j
= 175
°C
V
F
S
F
V
hys
I
D
/I
sense
forward voltage temperature
sense diode
temperature coefficient
temperature sense diode
forward voltage hysteresis
temperature sense diode
I
F
= 250
µA
I
F
= 250
µA;
−55 °C
< T
j
< +175
°C
125
µA
< I
F
< 250
µA
1.32
3.04
648
−1.4
25
450
1.55
3.57
658
−1.54
32
500
1.82
4.19
668
−1.68
50
550
Ω
Ω
mV
mV/K
mV
-
-
-
6.8
-
8
16
mΩ
mΩ
-
-
22
-
1000
10
nA
µA
-
-
20
0.1
-
22
10
250
-
µA
µA
V
2
1
-
3
-
-
4
-
4.4
V
V
V
55
50
-
-
-
-
V
V
Min
Typ
Max
Unit
Static characteristics
ratio of drain current to sense V
GS
> 5 V;
current
−55 °C
< T
j
< +175
°C
total gate charge
gate-source charge
gate-drain (Miller) charge
input capacitance
output capacitance
reverse transfer capacitance
V
GS
= 0 V; V
DS
= 25 V;
f = 1 MHz;
Figure 12
V
GS
= 10 V; V
DS
= 44 V;
I
D
= 25 A;
Figure 14
Dynamic characteristics
Q
g(tot)
Q
gs
Q
gd
C
iss
C
oss
C
rss
9397 750 11696
-
-
-
-
-
-
116
19
51
4200
920
500
-
-
-
-
-
-
nC
nC
nC
pF
pF
pF
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data
Rev. 01 — 19 August 2003
5 of 15
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