电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

5962H9656901QXA

产品描述Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20
产品类别逻辑    逻辑   
文件大小261KB,共23页
制造商Cobham PLC
下载文档 详细参数 选型对比 全文预览

5962H9656901QXA概述

Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20

5962H9656901QXA规格参数

参数名称属性值
包装说明DFP, FL20,.3
Reach Compliance Codeunknown
ECCN代码3A001.A.1.A
控制类型ENABLE LOW
系列ACT
JESD-30 代码R-XDFP-F20
JESD-609代码e0
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.012 A
位数4
功能数量2
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装等效代码FL20,.3
封装形状RECTANGULAR
封装形式FLATPACK
电源5 V
Prop。Delay @ Nom-Sup13 ns
传播延迟(tpd)13 ns
认证状态Qualified
筛选级别38535Q/M;38534H;883B
座面最大高度2.921 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
总剂量1M Rad(Si) V
宽度6.9215 mm
Base Number Matches1

5962H9656901QXA相似产品对比

5962H9656901QXA 5962H9656901QRC 5962H9656901VRC 5962H9656901QXC 5962H9656901VXA 5962H9656901QRA 5962H9656901VXC 5962H9656901VRA 5962H9656901Q9A
描述 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 Bus Driver, ACT Series, 2-Func, 8-Bit, Inverted Output, CMOS, DIE-20
包装说明 DFP, FL20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DFP, FL20,.3 DFP, FL20,.3 SIDE BRAZED, CERAMIC, DIP-20 BOTTOM BRAZED, CERAMIC, FP-20 SIDE BRAZED, CERAMIC, DIP-20 DIE, DIE OR CHIP
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A 3A001.A.1.A
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
系列 ACT ACT ACT ACT ACT ACT ACT ACT ACT
JESD-30 代码 R-XDFP-F20 R-XDIP-T20 R-XDIP-T20 R-XDFP-F20 R-XDFP-F20 R-XDIP-T20 R-XDFP-F20 R-XDIP-T20 R-XUUC-N20
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.012 A 0.012 A 0.012 A 0.012 A 0.012 A 0.012 A 0.012 A 0.012 A 0.012 A
位数 4 4 4 4 4 4 4 4 8
功能数量 2 2 2 2 2 2 2 2 2
端口数量 2 2 2 2 2 2 2 2 2
端子数量 20 20 20 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
封装代码 DFP DIP DIP DFP DFP DIP DFP DIP DIE
封装等效代码 FL20,.3 DIP20,.3 DIP20,.3 FL20,.3 FL20,.3 DIP20,.3 FL20,.3 DIP20,.3 DIE OR CHIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK IN-LINE IN-LINE FLATPACK FLATPACK IN-LINE FLATPACK IN-LINE UNCASED CHIP
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Prop。Delay @ Nom-Sup 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns
传播延迟(tpd) 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns 13 ns
认证状态 Qualified Qualified Qualified Qualified Qualified Qualified Qualified Qualified Qualified
筛选级别 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535V;38534K;883S 38535Q/M;38534H;883B 38535V;38534K;883S 38535Q/M;38534H;883B 38535V;38534K;883S 38535V;38534K;883S MIL-PRF-38535 Class Q
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO NO YES YES NO YES NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 FLAT THROUGH-HOLE THROUGH-HOLE FLAT FLAT THROUGH-HOLE FLAT THROUGH-HOLE NO LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL UPPER
总剂量 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V 1M Rad(Si) V
JESD-609代码 e0 e4 e4 e4 e0 e0 e4 e0 -
座面最大高度 2.921 mm 5.08 mm 5.08 mm 2.921 mm 2.921 mm 5.08 mm 2.921 mm 5.08 mm -
端子面层 TIN LEAD GOLD GOLD GOLD TIN LEAD TIN LEAD GOLD TIN LEAD -
端子节距 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm -
宽度 6.9215 mm 7.62 mm 7.62 mm 6.9215 mm 6.9215 mm 7.62 mm 6.9215 mm 7.62 mm -
Base Number Matches 1 1 1 1 1 1 1 1 -

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 86  122  208  289  1534 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved