Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I(ol) | 0.02 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 最大电源电流(ICC) | 23 mA |
| Prop。Delay @ Nom-Sup | 10 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54F258A/BEA | 54F258A/B2A | N74F258AN-B | N74F258DB | N74F258N-B | N74F258D-T | N74F258ADB | |
|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CQCC20 | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, PDSO16 | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, PDSO16, | Multiplexer, 4-Func, 2 Line Input, TTL, PDSO16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T16 | S-XQCC-N20 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I(ol) | 0.02 A | 0.02 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 20 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | DIP | SOP | DIP | SOP | SOP |
| 封装等效代码 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | SOP16,.25 | DIP16,.3 | SOP16,.25 | SOP16,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流(ICC) | 23 mA | 23 mA | 23 mA | 23 mA | 23 mA | 23 mA | 23 mA |
| Prop。Delay @ Nom-Sup | 10 ns | 10 ns | 9 ns | 11 ns | 11 ns | 11 ns | 9 ns |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
| 厂商名称 | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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