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40T40-100C

产品描述RF/Microwave Termination, 0MHz Min, 50000MHz Max, 40ohm
产品类别无线/射频/通信    射频和微波   
文件大小128KB,共2页
制造商Cobham PLC
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40T40-100C概述

RF/Microwave Termination, 0MHz Min, 50000MHz Max, 40ohm

40T40-100C规格参数

参数名称属性值
Reach Compliance Codeunknown
特性阻抗40 Ω
构造COMPONENT
最大工作频率50000 MHz
最小工作频率
射频/微波设备类型RF/MICROWAVE TERMINATION
Base Number Matches1

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Broadband Product Line
High Power Terminations Short Form
ADVANCED DATA SHEET
Model 10T Series
DC to 20 GHz
The 10T Series are High Power Thin-Film Terminations designed for use in 10 Gbit systems. An integrated DC
Block can be added to the termination for a reduction in DC current consumption and heat dissipation
10Gbit High Power Terminations
Aeroflex Part #
10T50-(100/500) (C/M )
10T40-(100/500) (C/M)
10T35-(100/500) (C/M)
DC
Termination
Value
50 ohms ±2%
40 ohms ±2%
35 ohms ±2%
Power
Handling
mW Min
100 / 500
100 / 500
100 / 500
Transmission
Line
CPWG / MS
CPWG / MS
CPWG / MS
S11, 0 - 20 GHz
-15 dB min
(with no wire-bonds)
-15 dB min
(with no wire-bonds, in 40W system)
-15 dB min
(with no wire-bonds, in 35W system)
Size
.138” x .079”
138” x .079“
138” x .079”
Notes:
1. These devices will need to be mounted on a heat sink with a good thermal / electrical conductive epoxy or solder.
2. Electrical connections are made through wire-bonds.
3. 100 = 100 mW, 500 = 500 mW, C = CPWG, M = Microstrip.
Model 40T Series
DC to 50 GHz
The 40T Series are High Power Thin-Film Terminations designed for use in 40 Gbit systems. An integrated DC
Block can be added to the termination for a reduction in DC current consumption and heat dissipation
40Gbit High Power Terminations
Aeroflex Part #
40T50-(100/500) (C/M)
40T40-(100/500) (C/M)
40T35-(100/500) (C/M)
DC
Termination
Value
50 ohms ±2%
40 ohms ±2%
35 ohms ±2%
Power
Handling
mW Min
100 / 500
100 / 500
100 / 500
Transmission
Line
CPWG / MS
CPWG / MS
CPWG / MS
S11, 0 - 20 GHz
-15 dB min
(with no wire-bonds)
-15 dB min
(with no wire-bonds, in 40W system)
-15 dB min
(with no wire-bonds, in 35W system)
Size
.138” x .079”
138” x .079“
138” x .079”
Notes:
1. These devices will need to be mounted on a heat sink with a good thermal / electrical conductive epoxy or solder.
2. Electrical connections are made through wire-bonds.
3. 100 = 100 mW, 500 = 500 mW, C = CPWG, M = Microstrip.
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