Line Receiver, 1 Func, 1 Rcvr, PDSO8
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | 3 MM, MSOP-8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 差分输出 | YES |
| 输入特性 | DIFFERENTIAL |
| 接口集成电路类型 | LINE RECEIVER |
| 接口标准 | GENERAL PURPOSE |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.93 mm |
| 标称负供电电压 | -3.3 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 最大接收延迟 | 0.24 ns |
| 接收器位数 | 1 |
| 座面最大高度 | 1.73 mm |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.94 mm |
| SY88927ZG-TR | SY88927ZG | SY88927ZGTR | SY88927V_05 | SY88927VZGTR | SY88927VKGTR | SY88927VKC-TR | SY88927VZC-TR | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Line Receiver, 1 Func, 1 Rcvr, PDSO8 | Line Receiver, 1 Func, 1 Rcvr, PDSO8 | LINE RECEIVER, PDSO8, 3 MM, MSOP-8 | 5V/3.3V 2.5Gbps HIGH-SPEED DIFFERENTIAL RECEIVER | 5V/3.3V 2.5Gbps HIGH-SPEED DIFFERENTIAL RECEIVER | 5V/3.3V 2.5Gbps HIGH-SPEED DIFFERENTIAL RECEIVER | IC RCVR 5V/3.3V 2.5GBPS 8-MSOP | IC RCVR 5V/3.3V 2.5GBPS 8-SOIC |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | - | - |
| 包装说明 | 3 MM, MSOP-8 | 3 MM, MSOP-8 | SOP, | - | SOP, SOP8,.25 | TSSOP, | - | - |
| Reach Compliance Code | compli | compli | unknow | - | compli | compli | - | - |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | S-PDSO-G8 | - | - |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | e4 | - | - |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 | - | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | SOP | SOP | SOP | - | SOP | TSSOP | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | SQUARE | - | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | - |
| 最大接收延迟 | 0.24 ns | 0.24 ns | 0.24 ns | - | 0.28 ns | 0.24 ns | - | - |
| 表面贴装 | YES | YES | YES | - | YES | YES | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | - | - |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 0.65 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | - | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
