Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, TTL, CQCC20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| 控制类型 | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 54LS245/B2A | N74LS245N | N74LS245N-B | 54LS245/BRA | N74LS245D-T | |
|---|---|---|---|---|---|
| 描述 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, TTL, CQCC20 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, TTL, PDIP20 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, TTL, PDIP20, | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, TTL, CDIP20 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, TTL, PDSO20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 控制类型 | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | S-XQCC-N20 | R-PDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | DIP | DIP | SOP |
| 封装等效代码 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 最大I（ol） | - | 0.024 A | 0.024 A | - | 0.024 A |
| Prop。Delay @ Nom-Sup | - | 12 ns | 12 ns | - | 12 ns |
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