REVISIONS
LTR
A
B
C
D
DESCRIPTION
Add vendor CAGE 27014. Add case outline E. Editorial and technical
changes throughout.
Add case outline X for CAGE 27014. Make changes to 1.2.4, theta JA,
theta JC, as specified in 1.3, and figure 1. - ro
Add case outlines Z and 4. - ro
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
96-05-22
99-09-07
02-05-02
08-02-20
APPROVED
M. A. FRYE
R. MONNIN
R. MONNIN
R. HEBER
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
RICK OFFICER
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL FRYE
MICROCIRCUIT, LINEAR, LOW DROPOUT, -15 V
VOLTAGE REGULATOR, MONOLITHIC SILICON
DRAWING APPROVAL DATE
95-12-21
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
13
5962-95709
DSCC FORM 2233
APR 97
5962-E089-08
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
95709
01
Q
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
LM2990-15
Circuit function
Low dropout, -15 V voltage regulator
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
M
N
T
U
X
Y
Z
2
4
Descriptive designator
GDIP1-T16 or CDIP2-T16
See figure 1
CBCC2-N3
See figure 1
See figure 1
GDFP1-G16
MBFM1-P2
CBCC1-N3
CQCC1-N20
See figure 1
Terminals
16
3
3
3
3
16
2
3
20
3
Package style
Dual-in-line
Surface mount package
Bottom terminal chip carrier
TO-257, single row flange mount
with non-isolated tab, glass sealed
TO-257, single row flange mount
with isolated tab, glass sealed
Flat pack with gullwing leads
TO-3, flange mount
Bottom terminal chip carrier
Square leadless chip carrier
Flange mount, glass sealed with
gull wing leads
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95709
SHEET
D
2
1.3 Absolute maximum ratings. 1/
Input voltage (V
IN
) ............................................................................ -26 V to +0.3 V
Output voltage (V
OUT
) ...................................................................... -15 V dc
Output current (I
OUT
):
Cases E, N, T, X, Y, and Z ............................................................
Cases M, U, and 4 .........................................................................
Case 2 ...........................................................................................
Internal power dissipation (P
D
) .........................................................
1.5 A
1.2 A
0.3 A
Internally limited 2/
Junction temperature (T
J
) ................................................................. +150°C
Storage temperature ......................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds):
Cases E and X ............................................................................... +260°C
Cases M, N, T, U, Y, Z, and 4 ....................................................... +300°C
Thermal resistance, junction-to-case (θ
JC
):
Case E ........................................................................................... 5°C/W
Cases N, T, and X ......................................................................... 3°C/W
Cases M and U .............................................................................. 4.2°C/W
Cases Y and 2 ............................................................................... See MIL-STD-1835
Case Z ........................................................................................... 4.5°C/W
Case 4 ........................................................................................... 5.8°C/W
Thermal resistance, junction-to-ambient (θ
JA
):
Case E ........................................................................................... 75°C/W
Cases M, N, T, U, and 2 ................................................................ 42°C/W
Case X ........................................................................................... 119°C/W
Case Y ........................................................................................... 35°C/W
Case Z ........................................................................................... 80°C/W
Case 4 ........................................................................................... 60°C/W
1.4 Recommended operating conditions.
Input voltage (V
IN
) ............................................................................ -20 V
Ambient operating temperature range (T
A
) ....................................... -55°C to +125°C
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The maximum power dissipation is a function of T
J
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J
– T
A
) /
θ
JA
. If this dissipation is exceeded, the die temperature will rise above +125°C, and the
device will eventually go into thermal shutdown at T
J
of approximately 160°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95709
SHEET
D
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95709
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
-14.70
-14.25
15
50
5
10
50
Unit
Output voltage
V
OUT
I
OUT
= 5 mA to 1 A
1
2,3
01
-15.30
-15.75
V
Quiescent current
I
Q
I
OUT
≤
1 A, 2/
V = -15 V
I
OUT
≤
1.0 A 3/
1
2,3
1
2,3
01
mA
I
OUT
= 1 A, 3/
V
IN
= -15 V
Line regulation voltage
V
RLN
V
IN
= -26 V to -16 V, 2/
I
OUT
= 5 mA
V
IN
= V
NOUT
- 1 V to
- 26 V,
I
OUT
= 5 mA 3/
Load regulation voltage
V
RLD
I
OUT
= 50 mA to 1 A 2/
1,2,3
1
2,3
1,2,3
01
-75
-120
-60
75
120
60
mV
1
2,3
01
-120
-190
-70
-100
120
190
70
100
0.3
mV
I
OUT
= 50 mA to 1 A 3/
1
2,3
Dropout voltage
V
DOUT
I
OUT
= 0.1 A, 2/ 3/
ΔV
OUT
≤
100 mV
I
OUT
= 1 A, 2/ 3/
ΔV
OUT
≤
100 mV
1,2,3
01
V
1
μV
Output noise voltage
V
ON
I
OUT
= 5 mA, 2/ 4/
f = 10 Hz to 100 Hz
I
OUT
= 5 mA, 3/
f = 10 Hz to 100 kHz
1,2,3
01
1800
1800
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95709
SHEET
D
5
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