REVISIONS
LTR
A
B
C
D
DESCRIPTION
Add case outline Y. Add vendor CAGE 69210. Editorial changes throughout.
Changes in accordance with NOR 5962-R150-92.
Changes in accordance with NOR 5962-R091-93.
Changes in accordance with NOR 5962-R001-95.
DATE (YR-MO-DA)
90-08-07
92-03-25
93-03-15
94-10-21
APPROVED
M. A. FRYE
M. A. FRYE
M. A. FRYE
M. A. FRYE
E
Add radiation hardness requirements. Redrawn. -rrp
00-03-24
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
PREPARED BY
JOSEPH A. KERBY
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, ADJUSTABLE,
POSITIVE, LOW DROPOUT, VOLTAGE
REGULATOR, MONOLITHIC SILICON
DRAWING APPROVAL DATE
89-06-13
AMSC N/A
REVISION LEVEL
E
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-89521
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E150-00
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962
R
89521
01
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Case
outline
(see 1.2.3)
Lead
finish
(see 1.2.4)
1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
1084
Circuit function
5.0 A positive regulator, adjustable
1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
2
Descriptive designator
MBFM1-P2
See figure 1
See figure 1
CQCC1-N20
Terminals
2
3
3
20
Package style
TO-3 can
TO-258 flange mounted with isolated
tab and glass seal
TO-258 flange mounted with
non-isolated tab and glass seal
Square leadless chip carrier
1.2.4 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Input to output voltage differential ..................................................................
Storage temperature range .............................................................................
Lead temperature (soldering, 10 seconds) .....................................................
Power dissipation (P
D
) ...................................................................................
Thermal resistance, junction-to-case (
JC
):
Case X and Y ..............................................................................................
Case Z .........................................................................................................
Case 2 .........................................................................................................
Junction temperature (T
J
) ...............................................................................
Output current (I
OUT
) .......................................................................................
35 V
-65
C to +150
C
+300
C
Internally limited
3.0
C/W
2.3
C/W
20
C/W
+150
C
5.0 A
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89521
SHEET
E
2
1.4 Recommended operating conditions.
Input to output voltage differential ..................................................................
Output current (I
OUT
) .......................................................................................
Ambient operating temperature range (T
A
) .....................................................
Full load current (I
FL
) .......................................................................................
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads(Si) / s)................... 100 Krads 1/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-973 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings (SMD's).
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Configuration Management.
Interface Standard For Microcircuit Case Outlines.
25 V dc
10 mA
-55
C to +125
C
3.0 A
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
1/ These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation
end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019,
condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89521
SHEET
E
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.3 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89521
SHEET
E
4
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/
-55
C
T
A
+125
C
unless otherwise specified
(V
IN
- V
OUT
) = 3.0 V,
I
OUT
= 10 mA
M,D,P,L,R
1.5 V
(V
IN
– V
OUT
)
25 V,
10 mA
I
OUT
3.0 A
Line regulation
3/
M,D,P,L,R
Test
Symbol
Group A
subgroups
1
1
1,2,3
1
1,2,3
1
1,2,3
Device
type
01
Limits
Min
1.238
1.238
1.225
1.225
Max
1.262
1.262
1.270
1.270
0.2
0.2
0.5
%
Unit
Reference voltage
V
REF
V
V
OUT
/
V
IN
1.5 V
(V
IN
– V
OUT
)
15 V
I
OUT
= 10 mA
M,D,P,L,R
15 V
(V
IN
– V
OUT
)
35 V
I
OUT
= 10 mA,
M,D,P,L,R
01
1
1
1
2,3
1,2,3
1
1
1
4,5,6
01
60
01
01
01
0.5
0.3
0.3
0.4
1.5
1.5
0.015
0.015
dB
%/W
V
%
Load regulation
3/
V
OUT
/
V
IN
(V
IN
– V
OUT
) = 3.0 V,
10 mA
I
OUT
3.0 A
M,D,P,L,R
(V
IN
– V
OUT
) = 3.0 V,
10 mA
I
OUT
3.0 A
Dropout voltage
V
DO
I
OUT
= 3.0 A,
V
REF
= 1%
M,D,P,L,R
30 ms pulse, T
A
= +25
C
M,D,P,L,R
f = 120 Hz, C
ADJ
= 25
F,
C
OUT
= 25
F (tantalum),
I
OUT
= 3.0 A,
(V
IN
– V
OUT
) = 3.0 V
Thermal regulation
----
Ripple rejection
V
IN
/
V
OUT
M,D,P,L,R
Adjust pin current
I
ADJ
1.5 V
(V
IN
– V
OUT
)
25 V,
I
OUT
= 10 mA,
I
OUT
= 3.0 A
M,D,P,L,R
Adjust pin current
change
10 mA
I
OUT
3.0 A,
4
1,2,3
01
60
120
A
1
1,2,3
01
120
5.0
I
ADJ
1.5 V
(V
IN
– V
OUT
)
25 V
M,D,P,L,R
1
5.0
A
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89521
SHEET
E
5
嵌入式系统
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