REVISIONS
LTR
A
DESCRIPTION
Add case outlines T and U. Add vendors CAGE 69210 and U4637. Change
limits for line regulation, load regulation tests and standby current drain test at
temperature. Add temperature testing limit for Ripple rejection test.
Add case outline 2. Editorial changes throughout.
Add case outline N. Remove vendor CAGE 48726. Change vendor CAGE
U4637 to U3158. Editorial changes throughout.
Add CAGE 27851 and case outline M. Make changes to 1.2.2, 1.3, 1.4, table I,
figure 1, and figure 2. - ro
Add radiation hardness requirements. - ro
Make change to case outline N. Add case outlines 4 and 5. Make changes to
1.2.3, 1.3, figure 1, and figure 2. – rrp
Add a footnote to the case outline U, TO-257 package as specified under 1.2.2
and figure 1. Make corrections to package style descriptions under 1.2.2. - ro
For case outline “T” only, add a footnote 1/ under 1.2.3 and make change to
note 2 under figure 1. - ro
DATE (YR-MO-DA)
89-08-08
APPROVED
M. A. FRYE
B
C
92-03-30
96-01-17
M. A. FRYE
M. A. FRYE
D
E
F
G
H
99-12-01
00-02-17
02-02-11
05-02-04
06-01-10
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
H
15
H
16
H
17
REV
SHEET
H
1
H
2
H
3
H
4
H
5
H
6
H
7
H
8
H
9
H
10
H
11
H
12
H
13
H
14
PREPARED BY
JOSEPH A. KERBY
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, POSITIVE 15 VOLT
REGULATOR, FIXED, MONOLITHIC SILICON
DRAWING APPROVAL DATE
88-07-28
AMSC N/A
REVISION LEVEL
H
SIZE
A
SHEET
CAGE CODE
67268
1 OF
17
5962-88553
DSCC FORM 2233
APR 97
5962-E144-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962
F
88553
01
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.3)
Lead
finish
(see 1.2.4)
\/
Drawing number
1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
7815A
Circuit function
Positive regulator, 15 volt fixed
1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
M
N
T 1/
U 1/
X
Y
Z
2
4
5
Descriptive designator
See figure 1
CBCC2-N3
See figure 1
See figure 1
See figure 1
See figure 1
MBFM4-P2
CQCC1-N20
See figure 1
CBCC1-N3
Terminals
3
3
3
3
3
2
2
20
3
3
Package style
Power surface mount
Bottom terminal chip carrier
TO-257 single row flange mount
and glass sealed
TO-257 single row flange mount
with isolated tab and glass sealed
TO-39 can
TO-3 flange mount
TO-66 flange mount
Square leadless chip carrier
Flange mount, glass sealed, with
gull wings
Bottom terminal chip carrier
1.2.4 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
____
1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88553
SHEET
H
2
1.3 Absolute maximum ratings.
Input voltage:
Operating or output shorted to ground ........................................................ 35 V dc
Transient ..................................................................................................... 50 V dc 2/
Power dissipation (P
D
):
T
C
= +25°C:
Case M .....................................................................................................
Cases N, T, U, Z, 4, and 5 .......................................................................
Cases X and 2 .........................................................................................
Case Y .....................................................................................................
T
A
= +25°C:
Cases M, T, U, and Z ..............................................................................
Case N ....................................................................................................
Cases X and 2 .........................................................................................
Case Y .....................................................................................................
Case 4 .....................................................................................................
Case 5 .....................................................................................................
Storage temperature range..............................................................................
Lead temperature (soldering, 10 seconds) ......................................................
Junction temperature (T
J
)................................................................................
Thermal resistance, junction-to-case (θ
JC
):
Case M.........................................................................................................
Cases N and T .............................................................................................
Case U .........................................................................................................
Case X .........................................................................................................
Case Y .........................................................................................................
Case Z .........................................................................................................
Case 2..........................................................................................................
Case 4 .........................................................................................................
Case 5 .........................................................................................................
Thermal resistance, junction-to-ambient (θ
JA
):
Cases M, T, U, and Z ..................................................................................
Cases N, X and 2 ........................................................................................
Case Y .........................................................................................................
Case 4 .........................................................................................................
Case 5 .........................................................................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
)...................................................... -55°C to +125°C
Input voltage range (V
IN
) ................................................................................. +17.5 V dc to +30 V dc
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads (Si) / s) .................. 300 Krads (Si) 4/
18 W
15 W
2W
20 W
3.0 W
1040 mW
1.0 W
4.3 W
1.7 W
1.3 W
-65°C to +150°C
+300°C
+150°C 3/
6.7°C/W
3.5°C/W
4.2°C/W
15°C/W
3°C/W
6°C/W
See MIL-STD-1835
5.1°C/W
3.6°C/W
42°C/W
120°C/W
29°C/W
60°C/W
80°C/W
2/
3/
4/
The 50 volt input rating refers to the ability of the regulator to withstand high line or transient conditions without damage.
Since the regulator’s maximum current capability is reduced, the output may fall out of regulation at high input voltages
under nominal loading.
The device is protected by thermal shutdown circuit which is designed to turn off the output transistor whenever the
device junction temperature is in excess of +150°C.
These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88553
SHEET
H
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88553
SHEET
H
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Min
Output voltage
V
OUT
T
A
= +25°C
M,D,P,L,R,F
V
IN
= 18.5 V to 30 V 4/
M,D,P,L,R,F
Line regulation 5/ 6/
V
RLINE
V
IN
= 17.5 V to 30 V,
-55°C
≤
T
J
≤
+125°C
M,D,P,L,R,F
V
IN
= 20 V to 26 V,
-55°C
≤
T
J
≤
+125°C
M,D,P,L,R,F
Load regulation 5/
V
RLOAD
I
O
= 5.0 mA to 1.5 A, 7/
-55°C
≤
T
J
≤
+125°C
M,D,P,L,R,F
I
O
= 5.0 mA to 1.0 A, 7/
-55°C
≤
T
J
≤
+125°C
I
O
= 250 mA to 750 mA, 7/
-55°C
≤
T
J
≤
+125°C
M,D,P,L,R,F
I
O
= 5.0 mA to 500 mA, 8/
-55°C
≤
T
J
≤
+125°C
Standby current drain
I
SCD
1
1
1,2,3
1
1
2,3
1
1
2,3
1
1
1
2,3
1
2,3
1
1
2,3
1
2,3
M,D,P,L,R,F
See footnotes at end of table.
1
01
01
01
01
14.8
14.8
14.6
14.6
Max
15.2
15.2
15.4
15.4
20
50
20
15
25
15
35
35
75
21
45
21
50
75
6.0
6.5
6.0
mA
mV
mV
V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88553
SHEET
H
5
NXP MCU
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