电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MMC03101003163FBLK

产品描述Fixed Resistor, Metal Glaze/thick Film, 2W, 316000ohm, 1000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 3610
产品类别无源元件    电阻器   
文件大小378KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 全文预览

MMC03101003163FBLK概述

Fixed Resistor, Metal Glaze/thick Film, 2W, 316000ohm, 1000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 3610

MMC03101003163FBLK规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
包装说明MELF, 3610
Reach Compliance Codecompliant
构造Cylindrical
JESD-609代码e0
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装直径2.67 mm
封装长度9.32 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法BULK
额定功率耗散 (P)2 W
额定温度80 °C
电阻316000 Ω
电阻器类型FIXED RESISTOR
尺寸代码3610
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差1%
工作电压1000 V
Base Number Matches1

文档预览

下载PDF文档
al Glaze
Glaze™ General Purpose
General Purpose
Metal
face
Surface Mount Power Resistor
Mount Power Resistor
es
Metal Glaze
General Purpose
·
Up to 2 watts
Mount Power Resistor
Surface
MM Series
MM Series
watts
00 volts
·
·
·
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
to 2.2 megohm
2
range
Up to watts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Up to 1000 volts
aximum operating temperature
60/40 Solder
temperature
dielectric
over nickel barrier
coating
60/40 Solder
over nickel barrier
High
High
temperature
dielectric
coating
ical Data
Electrical Data
Industry
Footprint
Maximum
Resistance
Maximum
Resistance
IRC
Working
Size
Industry
Power
IRC
Working
Range
Power
Range
Type
Voltage
Code Footprint
Type
Voltage
(ohms)²
Rating
Rating
(ohms)²
MMA0204
F
B
1206
MMA0204
Tolerance
(+%)³
(+%)³
1, 2, 5
1, 2, 5
Tolerance
1, 2, 5
5
0.5
5
TCR
Product
(ppm/°C)³
(ppm/°C)³
Category
100
50, 100
50, 100
100
50, 100
50, 100
100
50, 100
TCR
100
Product
Category
1206
1/2
1/2
400
400
0.1 to 0.99
0.1 to 0.99
Low Range
Standard
1.0
20 to 348K
to 1.0M
0.1 to 0.99
20 to 348K
1.0 to 1.0M
Low Range
Standard
1, 2,
0.25, 0.5
1, 2, 5
0.25,
1, 2, 5
0.25, 0.5
1, 2, 5
50, 100
Tolerance
Tight
100
Standard
Low
50, 100
Range
Tight Toleran
Tight Tolerance
2512
MMB0207
1
700
0.1 to 0.99
1.0 to 2.21M
20 to 348K
1, 2, 5
Low Range
Standard
2512
MMB0207
H
3610
MMC0310
1
2
700
1000
1.0 to 2.21M
0.1 to 0.99
20
1.0 to 2.21M
to 348K
0.1 to 0.99
1.0 to 2.21M
1,
1, 2, 5
2,
50, 100
Range
Low
100
50, 100
¹Not to exceed
P x R
0.25, 0.5
1, 2, 5
1, 2, 5
50, 100
Standard
Tight Toleran
Standard
²Consult factory for tighter TCR, tolerance, or resistance values.
3610
MMC0310
2
1000
Low Range
ceed
P x R
Environmental Data
Temperature Coefficient
Thermal Shock
²Consult
ri
factory for tighter
i
TCR, tolerance, or resistance values.
ethod
Characte stics
Max mum Change
Test M
As specified
±0.5% +0.01
±0.25% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
onmental Data
Low Temperature Operation
Characte
Short
cs
Overload
risti
Time
Maxim
±0.5%
Change
um
+0.01
Test Method
ture Coefficient
As
High Temperature Exposure
specified
+0.01
±0.5%
Resistance to Bonding Exposure
+0.01
+0.01
±0.5%
±0.25%
Solderability
Moisture Resistance
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow
(-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.3
soldered to board at 260°C for 10 seconds)
Shock
perature Operation
Life Test
±0.25% +0.01
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±0.5% +0.01
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
me Overload
mperature Exposure
Terminal Adhesion Strength
±0.5% +0.01
+0.01
±0.5%
±1% for R>100K
±1% +0.01
±0.5% +0.01
no mechanical damage
±0.5% +0.01
MIL-R-55342E Par 4.7.5
hours @ 70°C intermittent)
MIL-R-55342E Par 4.7.10 (2000
2.5 x
P x
push from underside of mounted chip for
1200 gram
R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Chip mounted in center of 90mm long board, deflected 5mm
60 seconds
ce to Bonding Exposure
General Note
General Note
Resistance to Board Bending
no mechanical damage
MIL-R-55342E Par 4.7.7
(Reflow
10 seconds
board at 260°C for 10 seconds
so as to exert pull on chip contacts for
soldered to
±0.25% +0.01
ility
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Facsimile:
Website: www.irctt.com
rpus Christi Te
r
A subsidiary of
Resistance
±0.5% +0.01
MIL-R-55342E
www.bitechnologies.com
cycles, total 240 hours)
Par 4.7.8 (10
www.irctt.com www.welwyn-tt.com
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
TT electronics plc
IRC reserves the right to make changes in product specification without notice or liability.
TT electronics reserves the right
and is considered accurate at time of going to print.
All information is subject to IRC’s own data
to make changes in product specification without notice or liability.
Wire and Film Technologies Division
Telephone:
© TT electronics plc
±0.5% +0.01
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent
09.12
各位大神好,求指教,求指导。我在学校做的创新项目需要
我就是想知道,如果笔记本和zigbee网相连怎么做,怎么做会比较简单,并且求推荐一个合适的zigbee模块让我买,我还要用到中继器,对这些真不懂,求帮忙梳理梳理。...
流云书雪 无线连接
TTL反相器电路中,VT4集电极上无电源提供,VT4如何饱和
TTL反相器电路中,书上提到,当输入高电平时,VT4因较大基极电流而饱和,但我认为此时因VT3截止,VT4集电极上无电源提供,无法满中发射结正偏,集电结正偏,VT4如何能饱和? ...
zlb0183 模拟电子
EEWORLD大学堂----英飞凌新能源汽车方案
英飞凌新能源汽车方案:https://training.eeworld.com.cn/course/1963英飞凌新能源汽车方案...
chenyy 汽车电子
来沪精英太强大了,,什么都要偷啊
一名外地来沪男子,竟然在上海一处公租房内大肆行窃,将整幢大楼18个楼层的36把门把手全部拆下偷走,最终被警觉的物业工作人员发现,昨天,该男子被民警抓获。 据了解,该男子偷门把手竟然是 ......
maoshen 聊聊、笑笑、闹闹
在Zigbee网络中终端难道不能用协调器的长地址与协调器通信吗
如题,我的终端设备用短地址0000与协调器通信没有问题,但是用协调器的长地址通信则不行,我对比了好几遍长地址,应该是没写错...
王鑫鹏 无线连接
STM8S请问有没有不用库的例程?
请问有没有不用库的例程?初学STM8S。 发现所以的例程序基本都调用库。用库的例程看起有点吃力。还是去对着库看,效率也不是很高。 想找一些不用库存的例程。主要是time1做PWM输出。串 ......
gueichun stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1043  1278  1418  2208  84  1  8  29  21  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved