REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
07-07-19
APPROVED
Thomas M. Hess
A
B
Change I
DDQ
in table IA. Add a footnote to table IA for V
OL
and V
OH
.
Change limits in table IIB. - jak
Add die for device types 01 and 02 with die appendix A. Update
radiation features in section 1.5 and add footnote 3/ for the device
type 02. Delete class M requirements. - MAA
13-01-08
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
B
15
B
16
B
17
B
18
REV
SHEET
B
19
B
20
B
21
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
B
12
B
13
B
14
PREPARED BY
Joseph A. Kerby
CHECKED BY
Charles F. Saffle
APPROVED BY
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
Thomas M. Hess
DRAWING APPROVAL DATE
07-03-28
MICROCIRCUIT, DIGITAL, RADIATION
HARDENED, LOW VOLTAGE CMOS, MINIMUM
SKEW ONE-TO-EIGHT CLOCK DRIVER, LVTTL
COMPATIBLE INPUTS AND OUTPUTS,
MONOLITHIC SILICON
SIZE
CAGE CODE
AMSC N/A
REVISION LEVEL
B
67268
SHEET
5962-06233
1 OF 21
5962-E461-12
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
H
06233
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54ALVC2525
Circuit function
Minimum skew, one-to-eight clock
driver, LVTTL compatible inputs
and outputs
Minimum skew, one-to-eight clock
driver, LVTTL compatible inputs
and outputs
02
54ALVC2525
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
14
Package style
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.
.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-06233
SHEET
B
2
1.3 Absolute maximum ratings. 1/
Core power supply voltage range (V
DD
) ..................................................................... -0.3 V dc to +4.0 V dc
Any clock input voltage range (V
IN
) ............................................................................ -0.3 V dc to V
DD
+ 0.3 V dc
Any clock output voltage range (V
OUT
) ....................................................................... -0.3 V dc to V
DD
+ 0.3 V dc
DC input current (I
I
) ...................................................................................................
±10
mA
Maximum power dissipation (P
D
) ............................................................................... 1000 mW
Storage temperature range (T
STG
) ............................................................................. -65°C to +150°C
Maximum junction temperature (T
J
) ........................................................................... +150°C 2/
Lead temperature (soldering, 10 seconds) ................................................................ 260°C
Thermal resistance, junction-to-case (θ
JC
) ................................................................. 20
°C/W
1.4 Recommended operating conditions.
Core operating voltage range (V
DD
) ........................................................................... +2.0 V dc to +3.6 V dc
Any clock input voltage range (V
IN
) ............................................................................ +0.0 V dc to V
DD
Any clock output voltage range (V
OUT
) ....................................................................... +0.0 V dc to V
DD
Case operating temperature range (T
C
) ..................................................................... -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (Dose rate = 50 – 300 rad(Si)/s):
Device type 01 .......................................................................................................... 1 Mrad(Si)
Device type 02 (effective dose rate = 1 rad (Si)/s) ..............................................
100 Krad(Si) 3/
Single event phenomenon (SEP):
2
No SEL occurs at effective LET (see 4.4.4.5) ........................................................... ≤ 111 MeV/( cm /mg) 4/ 5/
2
No SEU occurs at on set LET (see 4.4.4.5) .............................................................. ≤ 66 MeV/( cm /mg) 4/ 6/
-7
2
(Saturated cross section=5.5 x 10 cm /device)
2
No SEU occurs at on set LET (see 4.4.4.5) .............................................................. ≤ 52 MeV/( cm /mg) 4/ 7/
-7
2
(Saturated cross section=8.7 x 10 cm /device)
14
2
Neutron irradiation ...................................................................................................... 1 X 10 neutron/cm 4/
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. This is a stress rating
only, and functional operation for the device at these or any other conditions beyond limits indicated in the operational
sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability and performance.
Maximum junction temperature may be increased to +175°C during burn-in and steady state life tests.
Device type 02 is irradiated at dose rate = 50 - 300 rad (Si)/s in accordance with MIL-STD-883, method 1019,
condition A, and is guaranteed to a maximum total dose specified. The effective dose rate after extended room
temperature anneal = 1 rad (Si)/s per MIL-STD-883, method 1019, condition A, section 3.11.2. The total dose
specification for these devices only applies to the specified effective dose rate, or lower, environment.
Limits are guaranteed by design or process but not production tested unless specified by the customer through the
purchase order or contract.
Worse case temperature and voltage of T
C
= +125°C, V
DD
= 3.6 V.
T
C
= 25°C, V
DD
= 3.0 V, 200 MHz.
T
C
= 25°C, V
DD
= 2.0 V, 200 MHz.
2/
3/
4/
5/
6/
7/
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-06233
SHEET
B
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of Semiconductor Devices.
(Copies of this document are available online at
http://www.astm.org/
or from ASTM International, 100 Barr Harbor Drive, P.O.
Box C700, West Conshohocken, PA 19428-2959.)
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD20
JESD78
Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS devices.
IC Latch-Up Test.
(Copies of these documents are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology
Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-06233
SHEET
B
4
3.2.3 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table IA and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-06233
SHEET
B
5
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
