10K SERIES, 8-BIT ENCODER, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | 8 TO 4 LINE PRIORITY ENCODER; LATCHED OUTPUTS |
| 系列 | 10K |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.885 mm |
| 逻辑集成电路类型 | ENCODER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流（ICC） | 144 mA |
| 传播延迟（tpd） | 8.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.9 mm |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.885 mm |
| Base Number Matches | 1 |
| 5962-90561012A | 10565BEAJC | 10565BFAJC | 5962-9056101FA | 5962-9056101EA | |
|---|---|---|---|---|---|
| 描述 | 10K SERIES, 8-BIT ENCODER, CQCC20, CERAMIC, LCC-20 | 10K SERIES, 8-BIT ENCODER, CDIP16, CERDIP-16 | Encoder, 10K Series, 8-Bit, ECL, CDFP16, CERAMIC, FP-16 | 10K SERIES, 8-BIT ENCODER, CDFP16, CERAMIC, FP-16 | Encoder, 10K Series, 8-Bit, ECL, CDIP16, CERDIP-16 |
| 包装说明 | QCCN, | DIP, | DFP, | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 8 TO 4 LINE PRIORITY ENCODER; LATCHED OUTPUTS | 8 TO 4 LINE PRIORITY ENCODER; LATCHED OUTPUTS | 8 TO 4 LINE PRIORITY ENCODER; LATCHED OUTPUTS | 8 TO 4 LINE PRIORITY ENCODER; LATCHED OUTPUTS | 8 TO 4 LINE PRIORITY ENCODER; LATCHED OUTPUTS |
| 系列 | 10K | 10K | 10K | 10K | 10K |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 |
| 长度 | 8.885 mm | 19.495 mm | 9.65 mm | 9.65 mm | 19.49 mm |
| 逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DIP | DFP | DFP | DIP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 最大电源电流（ICC） | 144 mA | 144 mA | 144 mA | 144 mA | 144 mA |
| 传播延迟（tpd） | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.9 mm | 5.08 mm | 2.15 mm | 2.15 mm | 5.08 mm |
| 表面贴装 | YES | NO | YES | YES | NO |
| 技术 | ECL | ECL | ECL | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8.885 mm | 7.62 mm | 6.415 mm | 6.415 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 零件包装代码 | QLCC | DIP | - | DFP | - |
| 针数 | 20 | 16 | - | 16 | - |
| JESD-609代码 | e0 | - | - | e0 | e0 |
| 端子面层 | TIN LEAD | - | - | TIN LEAD | TIN LEAD |
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