REVISIONS
LTR
A
DESCRIPTION
Paragraph 1.2.1, add footnote 1/. Table I, correct test symbols: t
5
, t
6
, t
7
, t
8
, t
9
,
t
12
, t
14
, t
15
, t
24
, t
26
, t
27
, t
28
, t
30
and t
31
. Editorial changes throughout.
Updated boilerplate and made editorial changes throughout. - LTG
Update boilerplate to MIL-PRF-38535 requirements. - LTG
Update boilerplate to current MIL-PRF-38535 requirements. - CFS
DATE (YR-MO-DA)
91-06-12
APPROVED
William Heckman
B
C
D
00-07-25
01-06-21
07-06-11
Monica L. Poelking
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
Christopher A. Rauch
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Tim H. Noh
APPROVED BY
William K. Heckman
DRAWING APPROVAL DATE
89-07-13
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL, CMOS, REMOTE
TERMINAL MULTI-PROTOCOL, MONOLITHIC
SILICON
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
18
5962-88645
DSCC FORM 2233
APR 97
5962-E379-07
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88645
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
1553RTMP
Circuit function
Remote terminal multi-protocol
1/
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
CMGA15-P84
CQCC1-F84
CQCC1-N84
Terminals
84
84
84
Package style
Pin grid array
Unformed-lead chip carrier
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (V
DD
) ........................................................................................
DC input voltage range (V
IN
) ......................................................................................
DC output voltage range (V
OUT
)..................................................................................
Maximum power dissipation (P
D
)................................................................................
Storage temperature range ........................................................................................
Junction temperature (T
J
)...........................................................................................
Thermal resistance, junction to case (θ
JC
)..................................................................
Latchup immunity (I
LU
)................................................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
DD
) ........................................................................................
DC input voltage range (V
IN
) ......................................................................................
Operating frequency (F
O
) ...........................................................................................
Case operating temperature range (T
C
) .....................................................................
4.5 V dc to 5.5 V dc
0.0 V dc to V
DD
12
±0.01%
MHz
-55°C to +125°C
-0.3 V dc to +7.0 V dc
-0.3 V dc to (V
DD
+0.3 V dc)
-0.3 V dc to (V
DD
+0.3 V dc)
300 mW 2/
-65°C to +150°C
175°C
See MIL-STD-1835
±150
mA
__________
1/
2/
Mode selectable with either MIL-STD-1553A or MIL-STD-1553B bus protocol.
Must withstand the added P
D
due to short circuit test; e.g., I
OS
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88645
SHEET
D
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 2.
3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88645
SHEET
D
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88645
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions
4.5 V
≤
V
DD
≤
5.5 V
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Limits
Unit
Min
Input high voltage
Low input voltage
High level output voltage,
TTL outputs
Low level output voltage,
TTL outputs
Input leakage current,
TTL inputs
Inputs with pull-down
resistors
Inputs with pull-down
resistors
Inputs with pull-up
resistors
Quiescent current
Short circuit output
current
Operating supply current
Three-state output leakage
current, TTL outputs
Input capacitance
Output capacitance
Bidirectional I/O
capacitance
Functional tests
QI
DD
I
OS
1/ 2/
I
DD
1/
I
OZL
,
I
OZH
C
IN
C
OUT
C
I/O
See 4.3.1d
V
OUT
= V
DD
or V
SS
See 4.3.1c
4/
1, 2, 3
4
4
4
7, 8
All
All
All
All
All
-10
V
DD
= 5.5 V, V
OUT
= V
DD
V
DD
= 5.5 V, V
OUT
= 0.0 V
F
O
= 12 MHz, C
L
= 50 pF
V
IH
V
IL
V
OH
V
OL
I
IN
I
OH
= -400
µA
I
OL
= 3.2 mA
V
IN
= V
DD
or V
SS
V
IN
= V
DD
V
IN
= 2.4 V
V
IN
= V
SS
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
-100
1/
-1000
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
All
All
-1
100
2.4
2.0
Max
V
0.8
V
V
0.4
+1
1000
400
-100
1
+100
50
3/
+10
10
15
20
mA
mA
mA
µA
pF
pF
pF
V
µA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88645
SHEET
D
5
NXP MCU
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