REVISIONS
LTR
A
B
C
D
E
F
G
H
DESCRIPTION
Add vendor CAGE 69210. Add case outline U. Editorial changes throughout.
Changes in accordance with NOR 5962-R088-93.
Changes in accordance with NOR 5962-R206-94.
Changes in accordance with NOR 5962-R216-96.
Add radiation hardness requirements. Redrawn. – rrp
Add case outline Y. - ro
Drawing updated to reflect current requirements. - rrp
Make correction to Load regulation test unit column as specified under Table I.
Make a change to I
OUT
under footnote 3/ as specified under Table I. - ro
DATE (YR-MO-DA)
91-05-07
93-03-15
94-06-14
96-09-12
00-04-19
02-04-30
05-07-19
05-08-10
APPROVED
M. A. FRYE
M. A. FRYE
M. A. FRYE
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
H
1
H
2
H
3
H
4
H
5
H
6
H
7
H
8
H
9
H
10
H
11
H
12
H
13
PREPARED BY
MARCIA B. KELLEHER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES REUSING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, NEGATIVE
ADJUSTABLE REGULATOR, MONOLITHIC
SILICON
DRAWING APPROVAL DATE
88-01-08
AMSC N/A
REVISION LEVEL
H
SIZE
A
SHEET
CAGE CODE
67268
1 OF
13
5962-87741
DSCC FORM 2233
APR 97
5962-E447-05
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87741
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
1033
Circuit function
3.0 A negative regulator, adjustable
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
T
U
X
Y
Descriptive designator
See figure 1
See figure 1
MBFM1-P2
See figure 1
Terminals
3
3
2
3
Package style
TO-257 flange mounted with
non-isolated tab and glass sealed
TO-257 flange mounted with isolated
tab and glass sealed
TO-3 can
Flange mount, glass sealed with
gull wing leads
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Input to output voltage differential ...................................................................
Power dissipation (P
D
) ....................................................................................
Lead temperature (soldering, 10 seconds) .....................................................
Junction temperature (T
J
) ...............................................................................
Storage temperature range .............................................................................
Thermal resistance, junction-to-case (
θ
JC
):
Case T ........................................................................................................
Cases U and Y ............................................................................................
Case X ........................................................................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ..................................................... -55°C to +125°C
35 V dc
Internally limited
+300°C
+150°C
-65°C to +150°C
2.3°C/W
3.5°C/W
3.0°C/W
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87741
SHEET
H
2
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads(Si) / s) ................... 30 Krads (Si) 1/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
______
1/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87741
SHEET
H
3
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/ 3/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
Device
type
01
Limits
Min
-1.238
Max
-1.262
Unit
Reference voltage 4/
V
REF
|V
IN
– V
OUT
| = 5.0 V,
I
OUT
= 5.0 mA, T
A
= +25°C
M,D,P
|V
IN
– V
OUT
| = 3 V,
I
OUT
= 5 mA, 3 A
|V
IN
– V
OUT
| = 10 V,
IOUT = 5 mA, 3 A
|V
IN
– V
OUT
| = 20 V,
I
OUT
= 5 mA, 1.5 A
|V
IN
– V
OUT
| = 30 V,
I
OUT
= 5 mA, 0.7 A
|V
IN
– V
OUT
| = 35 V,
I
OUT
= 5 mA, 0.5 A
M,D,P
M,D,P
M,D,P
M,D,P
M,D,P
V
1
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
1
1
2,3
1
01
01
-1.238
-1.215
-1.215
-1.215
-1.215
-1.215
-1.215
-1.215
-1.215
-1.215
-1.215
-1.262
-1.285
-1.285
-1.285
-1.285
-1.285
-1.285
-1.285
-1.285
-1.285
-1.285
0.015
0.015
0.04
50
50
75
mV
%/V
Line regulation
5/
∆V
OUT
/
∆V
IN
3.0 V
≤
|V
IN
– V
OUT
|
≤
35 V
M,D,P
3.0 V
≤
|V
IN
– V
OUT
|
≤
35 V
Load regulation
5/
∆V
OUT
/
∆I
OUT
10 mA
≤
I
OUT
≤
3 A,
|V
OUT
|
≤
5.0 V
10 mA
≤
I
OUT
≤
3 A,
|V
OUT
|
≤
5.0 V
10 mA
≤
I
OUT
≤
3 A,
|V
OUT
|
≥
5.0 V
10 mA
≤
I
OUT
≤
3 A,
|V
OUT
|
≥
5.0 V
M,D,P
M,D,P
1
2,3
1
1
2,3
1.0
1.0
1.5
%
Thermal regulation
---
10 ms pulse, T
A
= +25°C
M,D,P
1
1
01
0.02
0.02
%/W
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87741
SHEET
H
4
TABLE I. Electrical performance characteristics - Continued.
Conditions 1/ 2/ 3/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
4
4
5, 6
Device
type
01
Limits
Min
56
56
53
Max
Unit
Ripple rejection 6/
∆V
IN
/
∆V
REF
V
OUT
= -10 V, f = 120 Hz,
C
ADJ
= 0
M,D,P
dB
V
OUT
= -10 V, f = 120 Hz,
C
ADJ
= 0
V
OUT
= -10 V, f = 120 Hz,
C
ADJ
= 10
µF
M,D,P
4
4
5, 6
70
70
60
V
OUT
= -10 V, f = 120 Hz,
C
ADJ
= 10
µF
Adjust pin current
I
ADJ
V
DIFF
= 35 V, I
L
= 10 mA
M,D,P
Adjust pin current
change
∆I
ADJ
10 mA
≤
I
OUT
≤
3 A
M,D,P
3.0 V
≤
|V
IN
– V
OUT
|
≤
35 V
M,D,P
Minimum load current
I
MIN
|V
IN
– V
OUT
|
≤
35 V
M,D,P
|V
IN
– V
OUT
|
≤
10 V
M,D,P
Current limit
4/
I
CL
|V
IN
– V
OUT
|
≤
10 V
M,D,P
|V
IN
– V
OUT
|
≤
10 V
|V
IN
– V
OUT
| = 20 V
M,D,P
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
1
1
2,3
1,2,3
1
01
100
100
µA
01
2.0
2.0
5.0
5.0
µA
01
5.0
5.0
3.0
3.0
mA
01
3.0
3.0
3.0
1.5
1.5
6.0
6.0
A
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87741
SHEET
H
5
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