10K SERIES, MONOSTABLE MULTIVIBRATOR, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | RETRIGGERABLE |
| 系列 | 10K |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.885 mm |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR |
| 数据/时钟输入次数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流（ICC） | 111 mA |
| 传播延迟（tpd） | 7 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 1.9 mm |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.885 mm |
| Base Number Matches | 1 |
| 5962-87773012A | GBU402 | GBU4G | 5962-8777301EA | 5962-8777301FA | |
|---|---|---|---|---|---|
| 描述 | 10K SERIES, MONOSTABLE MULTIVIBRATOR, CQCC20, CERAMIC, LCC-20 | 4.0Amp Glass Passivated Bridge Rectifiers | Glass Passivated Single-Phase Bridge Rectifier | 10K SERIES, MONOSTABLE MULTIVIBRATOR, CDIP16, CERDIP-16 | 10K SERIES, MONOSTABLE MULTIVIBRATOR, CDFP16, CERAMIC, DFP-16 |
| 零件包装代码 | QLCC | - | - | DIP | DFP |
| 包装说明 | QCCN, LCC20,.35SQ | - | - | DIP, DIP16,.3 | DFP, FL16,.3 |
| 针数 | 20 | - | - | 16 | 16 |
| Reach Compliance Code | unknown | - | - | unknown | unknown |
| 其他特性 | RETRIGGERABLE | - | - | RETRIGGERABLE | RETRIGGERABLE |
| 系列 | 10K | - | - | 10K | 10K |
| JESD-30 代码 | S-CQCC-N20 | - | - | R-GDIP-T16 | R-GDFP-F16 |
| JESD-609代码 | e0 | - | - | e0 | e0 |
| 长度 | 8.885 mm | - | - | 19.49 mm | 9.65 mm |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR | - | - | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
| 数据/时钟输入次数 | 1 | - | - | 1 | 1 |
| 功能数量 | 1 | - | - | 1 | 1 |
| 端子数量 | 20 | - | - | 16 | 16 |
| 最高工作温度 | 125 °C | - | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | - | - | OPEN-EMITTER | OPEN-EMITTER |
| 输出极性 | COMPLEMENTARY | - | - | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | - | - | DIP | DFP |
| 封装等效代码 | LCC20,.35SQ | - | - | DIP16,.3 | FL16,.3 |
| 封装形状 | SQUARE | - | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | - | IN-LINE | FLATPACK |
| 最大电源电流（ICC） | 111 mA | - | - | 111 mA | 111 mA |
| 传播延迟（tpd） | 7 ns | - | - | 7 ns | 7 ns |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 1.9 mm | - | - | 5.08 mm | 2.15 mm |
| 表面贴装 | YES | - | - | NO | YES |
| 技术 | ECL | - | - | ECL | ECL |
| 温度等级 | MILITARY | - | - | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | - | - | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | - | - | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | - | - | DUAL | DUAL |
| 宽度 | 8.885 mm | - | - | 7.62 mm | 6.415 mm |
| Base Number Matches | 1 | - | - | 1 | 1 |
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