Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20
参数名称 | 属性值 |
包装说明 | DFP, FL20,.3 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.1.A |
控制类型 | ENABLE LOW |
系列 | AC |
JESD-30 代码 | R-XDFP-F20 |
JESD-609代码 | e4 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.012 A |
位数 | 4 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装等效代码 | FL20,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 13 ns |
传播延迟(tpd) | 13 ns |
认证状态 | Qualified |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.921 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | GOLD |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
总剂量 | 1M Rad(Si) V |
宽度 | 6.9215 mm |
Base Number Matches | 1 |
5962H9656801QXC | 5962H9656801VXA | 5962H9656801QRA | SCK20100 | 5962H9656801VRC | 5962H9656801VRA | 5962H9656801VXC | |
---|---|---|---|---|---|---|---|
描述 | Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 | Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 | Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 | Power Thermistor for Limiting Inrush Current | Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 | Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 | Bus Driver, AC Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20 |
包装说明 | DFP, FL20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | - | DIP, DIP20,.3 | DIP, DIP20,.3 | BOTTOM BRAZED, CERAMIC, FP-20 |
Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown | unknown |
ECCN代码 | 3A001.A.1.A | 3A001.A.1.A | 3A001.A.1.A | - | 3A001.A.1.A | 3A001.A.1.A | 3A001.A.1.A |
控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW |
系列 | AC | AC | AC | - | AC | AC | AC |
JESD-30 代码 | R-XDFP-F20 | R-XDFP-F20 | R-XDIP-T20 | - | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 |
JESD-609代码 | e4 | e0 | e0 | - | e4 | e0 | e4 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.012 A | 0.012 A | 0.012 A | - | 0.012 A | 0.012 A | 0.012 A |
位数 | 4 | 4 | 4 | - | 4 | 4 | 4 |
功能数量 | 2 | 2 | 2 | - | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | - | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | - | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | - | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DFP | DIP | - | DIP | DIP | DFP |
封装等效代码 | FL20,.3 | FL20,.3 | DIP20,.3 | - | DIP20,.3 | DIP20,.3 | FL20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | IN-LINE | - | IN-LINE | IN-LINE | FLATPACK |
电源 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 13 ns | 13 ns | 13 ns | - | 13 ns | 13 ns | 13 ns |
传播延迟(tpd) | 13 ns | 13 ns | 13 ns | - | 13 ns | 13 ns | 13 ns |
认证状态 | Qualified | Qualified | Qualified | - | Qualified | Qualified | Qualified |
筛选级别 | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B | - | 38535V;38534K;883S | 38535V;38534K;883S | 38535V;38534K;883S |
座面最大高度 | 2.921 mm | 2.921 mm | 5.08 mm | - | 5.08 mm | 5.08 mm | 2.921 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | - | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY |
端子面层 | GOLD | TIN LEAD | TIN LEAD | - | GOLD | TIN LEAD | GOLD |
端子形式 | FLAT | FLAT | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
总剂量 | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V | - | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |
宽度 | 6.9215 mm | 6.9215 mm | 7.62 mm | - | 7.62 mm | 7.62 mm | 6.9215 mm |
Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | 1 |
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