REVISIONS
LTR
A
B
C
DESCRIPTION
Add device types 04, 05, and 06. Modify boilerplate to include rad hard
requirements. Editorial changes throughout.
Add device types 07, 08, and 09. Update boilerplate. Editorial changes
throughout. – TVN
In table I, change I
IN
limits; add footnote to I
DDQ
; add t
c
in power-up master
reset timing section; add footnote to V
OS
and V
DIS
. Correct the JTAG timing
waveforms. Change footnote 3/ in table III. – TVN
Add device types 10 and 11. Editorial changes throughout. - TVN
Add notes to memory write and memory read waveforms. Editorial changes
throughout. – TVN
Correct dimension L for case outline Y in figure 1. Also, correct footnote 1/ for
radiation exposure connections in figure 6. – TVN
Specify PDA criteria in table IIA footnotes and in paragraph 4.2.2b. – CFS
Update boilerplate paragraphs to current MIL-PRF-38535 requirements. – CFS
Add detail B for figure 1, case outline Y. - PHN
Update radiation features in section 1.5 and SEP table IB per GIDEP. Delete
class M requirements throughout. - MAA
DATE (
YR-MO-DA
)
96-03-13
98-08-27
99-04-28
APPROVED
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
D
E
F
G
H
J
K
00-06-27
01-03-13
01-07-27
03-10-28
09-03-16
11-03-22
13-05-20
Monica L. Poelking
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
David J. Corbett
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
K
35
K
15
K
36
K
16
K
37
K
17
K
18
REV
SHEET
PREPARED BY
Thomas M. Hess
K
19
K
20
K
21
K
1
K
22
K
2
K
23
K
3
K
24
K
4
K
25
K
5
K
26
K
6
K
27
K
7
K
28
K
8
K
29
K
9
K
30
K
10
K
31
K
11
K
32
K
12
K
33
K
13
K
34
K
14
STANDARD
MICROCIRCUIT
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
95-03-31
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, CMOS, RADIATION
HARDENED, SERIAL MICROCODED MULTI-MODE
INTELLIGENT TERMINAL AND TRANSCEIVER,
MONOLITHIC SILICON.
AMSC N/A
REVISION LEVEL
SIZE
CAGE CODE
K
DSCC FORM 2233
APR 97
A
67268
SHEET
1
OF
5962-94663
37
5962-E359-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
H
94663
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
Generic number
69151-LX15
69151-DX
69151-LX12
69151-LXE15
69151-DXE
69151-LXE12
69151-LXE15
69151-DXE
69151-LXE12
69151-LXE15
69151-DXE
Circuit function
Serial microcoded multi-mode intelligent terminal with
15-volt transceiver
Serial microcoded multi-mode intelligent terminal with
5-volt transceiver
Serial microcoded multi-mode intelligent terminal with
12-volt transceiver
Enhanced serial microcoded multi-mode intelligent
terminal with 15-volt transceiver radiation hardened
Enhanced serial microcoded multi-mode intelligent
terminal with 5-volt transceiver radiation hardened
Enhanced serial microcoded multi-mode intelligent
terminal with 12-volt transceiver
Enhanced serial microcoded multi-mode intelligent
terminal with 15-volt transceiver
Enhanced serial microcoded multi-mode intelligent
terminal with 5-volt transceiver
Enhanced serial microcoded multi-mode intelligent
terminal with 12-volt transceiver
Enhanced serial microcoded multi-mode intelligent
terminal with 15-volt transceiver radiation hardened
Enhanced serial microcoded multi-mode intelligent
terminal with 5-volt transceiver radiation hardened
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94663
SHEET
K
2
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
100
100
Package style
Pin grid array
1/
Leaded chip carrier with
nonconductive tier bar
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.
1.3 Absolute maximum ratings.
2/
-65°C to +150°C
-55°C to +125°C
-22 V dc
-0.3 V dc to +7.0 V dc
-0.3 V dc to +7.0 V dc
42 V
P,L-L
10 V
P,L-L
5W
-0.3 V dc to V
DD
+ 0.3 V dc
±150
mA
±10
mA
190 mA
1000 mA
+150°C
-11 V dc to +11 V dc
-5 V dc to +5 V dc
+300°C
7°C/W
Storage temperature range (T
STG
) .............................................................................
Operating case temperature range (T
C
) .....................................................................
Transceiver supply voltage (V
EE
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Transceiver supply voltage range (V
CC
):
Device types 02, 05, 08, 11 ...................................................................................
Logic supply voltage range (V
DD
) ...............................................................................
Input voltage range (V
DR
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device types 02, 05, 08, 11 ...................................................................................
Maximum power dissipation (P
D
) ...............................................................................
Logic voltage on any pin range (V
I/O
) .........................................................................
Logic latch-up immunity (I
LU
) .....................................................................................
Logic input current (I
I
) ................................................................................................
Output current (I
O
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device types 02, 05, 08, 11 ...................................................................................
Maximum junction temperature (T
J
) ...........................................................................
Receiver common mode input voltage range (V
IC
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device types 02, 05, 08, 11 ...................................................................................
Lead temperature (soldering, 5 seconds) ..................................................................
Thermal resistance junction-to-case (θ
JC
): 3/
Cases X and Y .......................................................................................................
____________
1/
2/
This package contains 96 terminals on the bottom and 4 terminals on top of the package, see figure 1.
Stresses above the listed absolute maximum rating may cause permanent damage to the device. This is a stress rating
only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational
sections of this specification is not recommended. Extended operation at the maximum levels may degrade performance
and affect reliability.
Per MIL-STD-883, Method 1012.
3/
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94663
SHEET
K
3
1.4 Recommended operating conditions.
Transceiver supply voltage range (V
CC
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device type 02 .......................................................................................................
Device types 05, 08, 11 .........................................................................................
Logic supply voltage range (V
DD
) ...............................................................................
Transceiver supply voltage range (V
EE
):
Device types 01, 04, 07, 10 ...................................................................................
Device types 03, 06, 09 .........................................................................................
Receiver differential voltage (V
DR
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device types 02, 05, 08, 11 ...................................................................................
Logic dc input voltage range (V
IN
) ..............................................................................
Receiver common mode input voltage (V
IC
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device types 02, 05, 08, 11 ...................................................................................
Driver peak output current (I
O
):
Device types 01, 03, 04, 06, 07, 09, 10 .................................................................
Device types 02, 05, 08, 11 ...................................................................................
Serial data rate range (S
D
) .........................................................................................
Clock duty cycle (D
C
) .................................................................................................
Case operating temperature range (T
C
) .....................................................................
Operating frequency (F
IN
) ..........................................................................................
1.5 Radiation features.
Maximum total dose available dose rate = 50 – 300 rads (Si)/s):
Device types 04, 10 ............................................................................................... 100 Krads (Si)
Device type 05 ....................................................................................................... 1 Mrads (Si)
Device type 11 ....................................................................................................... 300 Krads (Si)
Single event phenomenon (SEP) :
For device type 04:
2
No SEL occurs at effective LET (see 4.4.4.2) ......................................................... ≤ 60 MeV-cm /mg 1/
2
No SEU occurs at effective LET ............................................................................. ≤ 36 MeV-cm /mg 1/
For device type 05:
2
No SEL occurs at effective LET (see 4.4.4.2) ......................................................... ≤ 60 MeV-cm /mg 1/
2
No SEU occurs at effective LET ............................................................................. ≤ 36 MeV-cm /mg 1/
For device type 10:
2
No SEL occurs at effective LET (see 4.4.4.2) ......................................................... ≤ 80 MeV-cm /mg 1/
2
No SEU occurs at effective LET ............................................................................. ≤16 MeV-cm /mg 1/
For device type 11:
2
No SEL occurs at effective LET (see 4.4.4.2) ......................................................... ≤ 99 MeV-cm /mg 1/
2
No SEU occurs at effective LET ............................................................................. ≤ 16 MeV-cm /mg 1/
1.6 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, method 5012) ................................................................ 95.12 percent
+4.75 V dc to +5.5 V dc
+4.75 V dc to +5.25 V dc
+4.5 V dc to +5.5 V dc
+4.5 V dc to +5.5 V dc
-15 V dc
-12 V dc
40 V
P-P
8.0 V
P-P
0 V dc to V
DD
±10
V dc
±5.0
V dc
180 mA
700 mA
0 to 1 MHz
50
±
5%
-55°C to +125°C
24 MHz
±
0.01%
___________
1/
Contact the manufacturer for SEP data. The SEP response is dependent upon the combination of protocol devices and
transceiver devices.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94663
SHEET
K
4
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Methods Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation or contract.
THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
IEEE Standard 1149.1 -
IEEE Standard Test Access Port and Boundary Scan Architecture.
(Copies of these documents are available online at
http://www.ieee.org
or from the IEEE Service Center, 445 Hoes Lane, P.O.
Box 1331, Piscataway, NJ 08855–1331.
ASTM INTERNATIONAL (ASTM)
ASTM F 1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of Semiconductor Devices.
(Copies of this document is available online at
http://www.astm.org
or from ASTM International, P. O. Box C700,
100 Barr Harbor Drive, West Conshohocken, PA 19428-2959).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94663
SHEET
K
5
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