Bus Driver, F/FAST Series, 2-Func, 4-Bit, True Output, TTL, CDIP20, CERDIP-20
| 参数名称 | 属性值 |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION |
| 系列 | F/FAST |
| JESD-30 代码 | R-CDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 24.515 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大电源电流（ICC） | 90 mA |
| 传播延迟（tpd） | 7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8687401RA | 5962-86874012A | 5962-8687401SA | 54F241/BSAJC | 54F241/BRAJC | 54F241M/B2AJC | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, F/FAST Series, 2-Func, 4-Bit, True Output, TTL, CDIP20, CERDIP-20 | F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | Bus Driver, F/FAST Series, 2-Func, 4-Bit, True Output, TTL, CDFP20, CERAMIC, FP-20 | F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20, CERDIP-20 | F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 |
| 包装说明 | DIP, | QCCN, LCC20,.35SQ | DFP, | DFP, FL20,.3 | DIP, DIP20,.3 | CERAMIC, LCC-20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION | OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-CDIP-T20 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 | R-CDIP-T20 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 24.515 mm | 8.885 mm | 12.7 mm | 12.7 mm | 24.515 mm | 8.89 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DFP | DFP | DIP | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE | CHIP CARRIER |
| 最大电源电流（ICC） | 90 mA | 90 mA | 90 mA | 90 mA | 90 mA | 90 mA |
| 传播延迟（tpd） | 7 ns | 7 ns | 7 ns | 7 ns | 7 ns | 7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.9 mm | 2.16 mm | 2.16 mm | 5.08 mm | 1.9 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | FLAT | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 8.885 mm | 6.475 mm | 6.475 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 控制类型 | - | ENABLE LOW/HIGH | - | ENABLE LOW/HIGH | ENABLE LOW/HIGH | ENABLE LOW/HIGH |
| 最大I（ol） | - | 0.048 A | - | 0.048 A | 0.048 A | 0.048 A |
| 封装等效代码 | - | LCC20,.35SQ | - | FL20,.3 | DIP20,.3 | LCC20,.35SQ |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5 V | - | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | - | 7 ns | - | 7 ns | 7 ns | 7 ns |
| 筛选级别 | - | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
NXP MCU
微控制器 MCU
模拟与混合信号
嵌入式系统
嵌入式系统
FPGA/CPLD
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