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5962-9461108HTC

产品描述Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66
产品类别存储    存储   
文件大小368KB,共9页
制造商Cobham Semiconductor Solutions
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5962-9461108HTC概述

Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66

5962-9461108HTC规格参数

参数名称属性值
零件包装代码PGA
包装说明PGA,
针数66
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最长访问时间25 ns
其他特性ALSO CONFIGURABLE AS 2M X 8
备用内存宽度16
JESD-30 代码S-CPGA-P66
JESD-609代码e4
内存密度16777216 bit
内存集成电路类型CACHE SRAM MODULE
内存宽度32
功能数量1
端子数量66
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织512KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码PGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度4.699 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层GOLD
端子形式PIN/PEG
端子节距2.54 mm
端子位置PERPENDICULAR
Base Number Matches1

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ACT–S512K32 High Speed
16 Megabit SRAM Multichip Module
Features
4 Low Power CMOS 512K x 8 SRAMs in one MCM
Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8
Input and Output TTL & CMOS Compatible Design
Fast 17,20,25,35,45,55ns Access Times
Full Commercial, Industrial and Military (-55°C to +125°C)
CIRCUIT TECHNOLOGY
www.aeroflex.com
General Description
The ACT–S512K32 is a High
Speed, 16 megabit CMOS
SRAM
Multichip
Module
(MCM) designed for full
temperature range industrial,
military, or space, mass
memory and fast cache
applications.
The MCM can be organized
as a 512K x 32 bit, 1M x 16 bit
or 2M x 8 bit device and is
input
and
output
TTL
compatible. Writing is executed
when the write enable (WE)
and chip enable (CE) inputs
are low and output enable (OE)
input is high. Reading is
accomplished when WE is high
and CE and OE are both low.
Access time grades of 17ns,
20ns, 25ns, 35ns, 45ns and
55ns maximum are standard
high speed versions.
The +5 Volt power supply
version is standard and +3.3
Volt lower power model is a
future optional product.
The products are designed
for
operation
over
the
temperature range of -55°C to
+125°C and under the full
military environment. DESC
Standard Military Drawing
(SMD) numbers are released.
The
ACT-S512K32
is
manufactured in Aeroflex’s
80,000
square
foot
MIL-PRF-38534
certified
facility in Plainview, N.Y.
Temperature Range
MIL-PRF-38534 Compliant MCMs Available
+5 V Power Supply
Available in two Surface Mount Packages, and two PGA Type Package
68–Lead, Low Profile CQFP(F1), 1.56"SQ x .140"max
68–Lead, Dual-Cavity CQFP(F2), 0.88"SQ x .20"max
(.18 max thickness available, contact factory for details)
(Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint)
68–Lead, Single-Cavity CQFP (F18), .94"SQ x .140"max
(Drops into the 68
Lead JEDEC .99"SQ CQFJ footprint)
66 Pin, 1.38" x 1.38" x .245" PGA Type, Aeroflex code# "P1"
66 Pin, 1.09" x 1.09" x .185" PGA Type, With Shoulder, Aeroflex code# "P7"
Internal Decoupling Capacitors
DESC SMD# 5962–94611 Released (F1,F2,F18,P1,P7)
Block Diagram – PGA Type Package (P1,P7) & CQFP (F2,F18)
Pin Description
WE
1
CE
1
WE
2
CE
2
WE
3
CE
3
WE
4
CE
4
I/O
0-31
A
0
– A
18
OE
512Kx8
512Kx8
512Kx8
512Kx8
A
0–18
WE
1–4
CE
1–4
OE
V
cc
8
I/O
0-7
8
I/O
8-15
8
I/O
16-23
8
I/O
24-31
GND
NC
Data I/O
Address Inputs
Write Enables
Chip Enables
Output Enable
Power Supply
Ground
Not Connected
Block Diagram – CQFP(F1)
Pin Description
CE
1
WE
OE
A
0
– A
18
512Kx8
512Kx8
512Kx8
512Kx8
CE
2
CE
3
CE
4
I/O
0-31
A
0–18
WE
CE
1–4
OE
V
cc
8
I/O
0-7
8
I/O
8-15
8
I/
O
16-23
8
I/O
24-31
GND
NC
Data I/O
Address Inputs
Write Enable
Chip Enables
Output Enable
Power Supply
Ground
Not Connected
eroflex Circuit Technology - Advanced Multichip Modules © SCD1660 REV D 5/21/01

 
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