F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.885 mm |
| 逻辑集成电路类型 | AND GATE |
| 最大I（ol） | 0.02 A |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 9.7 mA |
| Prop。Delay @ Nom-Sup | 7.6 ns |
| 传播延迟（tpd） | 7.5 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 1.9 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.885 mm |
| Base Number Matches | 1 |
| 54F11/B2AJC | JM38510/34002BCA | JM38510/34002B2A | JM38510/34002BDA | |
|---|---|---|---|---|
| 描述 | F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, CERDIP-14 | F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, CERAMIC, FP-14 |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, | CERAMIC, LCC-20 | CERAMIC, FP-14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 |
| 长度 | 8.885 mm | 19.495 mm | 8.885 mm | 9.65 mm |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 |
| 端子数量 | 20 | 14 | 20 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DIP | QCCN | DFP |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK |
| 传播延迟（tpd） | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.9 mm | 5.08 mm | 1.9 mm | 2.15 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL |
| 宽度 | 8.885 mm | 7.62 mm | 8.885 mm | 6.415 mm |
| Base Number Matches | 1 | - | 1 | 1 |
| 厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
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