REVISIONS
LTR
A
B
C
D
E
F
DESCRIPTION
Changes in accordance with NOR 5962-R208-93.
Changes in accordance with NOR 5962-R187-94.
Add device type 02. Editorial changes throughout.
Changes in accordance with NOR 5962-R299-97.
Add device type 03. Editorial changes throughout. - TVN
In table IA: Add test conditions for I
IN
; change the limits for Q
IDD
; remove the
test condition V
DD
= 4.5 V for all the propagation delay tests; change the limits
for t
a
and t
i
in memory read timing section; change the limits of t
c
in DMA
timing section; and change the limit of t
a
in JTAG timing section. Include pin
connections for case outlines X and Z in radiation exposure connections.
Editorial changes throughout. - TVN
In table I, change I
IN
limits; add a footnote to Q
IDD
; add t
c
in power-up master
reset timing section. Correct the JTAG timing waveforms. – TVN
Add device type 04. Editorial changes throughout. – TVN
Add notes to memory write and memory read waveforms. Add figure B-1 to
appendix A. Editorial changes throughout. – TVN
Update boilerplate to MIL-PRF-38535 requirements, to include radiation
hardness assurance requirements. – CFS
Correct die thickness in appendix A. Correct high level output voltage test
condition I
OH
in table IA. Correct address bus pins (A5-A15) description and
add footnote 4/ in table III. Update electrical test requirements for group C and
group D in table IIA. - MAA
Correct package type Y case outline dimensions A1 and L in figure 1. - MAA
Add MIL-STD-1553 protocol stress test (Fstress) and add footnote10 / to
table IA – MAA
DATE (
YR-MO-DA
)
93-08-06
94-06-08
96-01-05
97-05-29
98-06-29
98-09-18
APPROVED
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
G
H
J
K
L
99-05-26
00-07-18
01-03-15
07-07-30
11-06-07
Monica L. Poelking
Monica L. Poelking
Thomas M. Hess
Thomas M. Hess
David J. Corbett
M
N
11-11-14
12-05-08
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
N
35
N
15
N
36
N
16
N
37
N
17
N
38
N
18
REV
N
39
N
19
N
40
N
20
N
41
N
21
N
1
N
42
N
22
N
2
N
43
N
23
N
3
N
44
N
24
N
4
N
45
N
25
N
5
N
46
N
26
N
6
N
47
N
27
N
7
N
48
N
28
N
8
N
49
N
29
N
9
N
50
N
30
N
10
N
31
N
11
N
32
N
12
N
33
N
13
N
34
N
14
SHEET
PREPARED BY
Thomas M. Hess
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
93-06-07
REVISION LEVEL
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, CMOS, RADIATION
HARDNENED, MIL-STD-1553 SERIAL MICRO-CODED
MONOLITHIC MULTI-MODE INTELLIGENT TERMINAL,
MONOLITHIC SILICON
SIZE
CAGE CODE
A
N
67268
SHEET
5962-92118
1 OF 50
DSCC FORM 2233
APR 97
5962-E280-12
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
H
92118
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
UT69151
UT69151E
UT69151E
UT69151C
Circuit function
MIL-STD-1553 bus controller, remote terminal, monitor interface
MIL-STD-1553 bus controller, remote terminal, monitor interface
radiation hardened
MIL-STD-1553 bus controller, remote terminal, monitor interface
MIL-STD-1553 bus controller, remote terminal, monitor interface
radiation hardened
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
CMGA3-P84
See figure 1
See figure 1
Terminals
84
84
132
Package style
Pin grid array
Leaded chip carrier
Leaded chip carrier with unformed
leads, nonconductive tier bar
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-92118
SHEET
N
2
1.3 Absolute maximum ratings.
1/
Supply voltage range (V
DD
) .................................................................................. -0.3 V dc to +7.0 V dc
Voltage on any pin ............................................................................................... -0.3 V dc to V
CC
+ 0.3 V dc
Latchup immunity (I
LU
) .........................................................................................
±150
mA
DC input current (I
I
)..............................................................................................
±10
mA
Maximum power dissipation (P
D
) ......................................................................... 2.5 W
Storage temperature range (T
STG
) ....................................................................... -65°C to +150°C
Lead temperature (soldering, 5 seconds) ............................................................ +300°C
Thermal resistance, junction-to-case (θ
JC
) ........................................................... 15°C/W
Maximum junction temperature (T
J
) ..................................................................... 175°C
1.4 Recommended operating conditions.
Supply voltage range (V
DD
) .................................................................................. +4.5 V dc to +5.5 V dc
DC input voltage (V
IN
) .......................................................................................... 0 V dc to V
DD
Maximum input voltage (V
IL)
................................................................................. 0.8 V dc
Maximum input voltage, 24 MHz input (V
ILC
) ....................................................... 0.3 V
DD
Minimum input voltage (V
IH
) ................................................................................. 2.2 V dc
Minimum input voltage, 24 MHz input (V
IHC
) ........................................................ 0.7 V
DD
Operating frequency (f
IN
)...................................................................................... 24
±0.01%
MHz
Duty cycle (D
C
)..................................................................................................... 50
±5%
Case operating temperature range (T
C
) ............................................................... -55°C to +125°C
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s):
6
Device type 02 ............................................................................................... 1 x 10 rads (Si)
Device type 04 ............................................................................................... 300K rads (Si)
Single event phenomena (SEP):
No SEU occurs at effective LET (see 4.4.4.5):
2
Device type 02 ..........................................................................................≤ 47 MeV/(mg/cm ) 2/
2
Device type 04 ..........................................................................................≤ 14.4 MeV/(mg/cm ) 2/
No SEL occurs at effective LET (see 4.4.4.5):
2
Device type 02 .......................................................................................... ≤ 136 MeV/(mg/cm ) 2/
2
Device type 04 .......................................................................................... ≤ 128 MeV/(mg/cm ) 2/
Dose rate upset (20 ns pulse) .............................................................................. 2/ 3/
Dose rate latchup ................................................................................................. 2/ 3/
Dose rate survivability .......................................................................................... 2/ 3/
Neutron irradiation ............................................................................................... 2/ 3/
1.6 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ..................................................... 95.12 percent
__________
1/
2/
3/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Limits are guaranteed by design or process but not production tested unless specified by the customer through the
purchase order or contract.
When characterized as a result of the procuring activities request, the condition will be specified.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-92118
SHEET
N
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of Semiconductor Devices.
(Copies of this document are available online at
http://www.astm.org
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA 19428-2959.)
INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture.
(Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane,
Piscataway, NJ 08854-4150.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-92118
SHEET
N
4
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Boundary scan instruction codes. The boundary scan instruction codes shall be as specified on figure 4.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figures 5
through 13.
3.2.6 Radiation exposure connections. The radiation exposure connections shall be as specified on figure 14.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 105 (see MIL-PRF-38535, appendix A).
3.11 IEEE 1149.1 compliance. Theses devices shall be compliant with IEEE 1149.1.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-92118
SHEET
N
5
NXP MCU
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