NAND Gate, TTL, CDFP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | NAND GATE |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54F10/BDA | 54F10/BCA | 54F11/B2A | 54F11/BCA | 54F11/BDA | 54F10/B2A | |
|---|---|---|---|---|---|---|
| 描述 | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDIP14, | AND Gate, TTL, CQCC20, | AND Gate, TTL, CDIP14, | AND Gate, TTL, CDFP14, | NAND Gate, TTL, CQCC20, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DFP, FL14,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDFP-F14 | R-XDIP-T14 | S-XQCC-N20 | R-XDIP-T14 | R-XDFP-F14 | S-XQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | AND GATE | AND GATE | AND GATE | NAND GATE |
| 端子数量 | 14 | 14 | 20 | 14 | 14 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | DIP | QCCN | DIP | DFP | QCCN |
| 封装等效代码 | FL14,.3 | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | FL14,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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