The documentation process conversion
measures necessary to comply with this
revision shall be completed by 23 August 1997
INCH POUND
MIL-PRF-19500/501C
23 May 1997
SUPERSEDING
MIL-S-19500/501B
25 March 1995
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICE, DARLINGTON TRANSISTOR, PNP, SILICON, POWER
TYPE 2N6051, 2N6052 JAN, JANTX, AND JANTXV
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for PNP, Darlington, silicon, power transistors. Three levels of
product assurance are provided for each device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (TO-3).
1.3 Maximum ratings.
|
PT
1/
| VCBO
|
|
| TC = +25°C | TC = +100°C |
|
|
|
|
| W
| W
| V dc
| 2N6051 | 150
| 75
| 80
| 2N6052 | 150
| 75
| 100
1/ Derate linearly at 1.00 W/°C above TC > +25°C.
1.4 Primary electrical characteristics.
|
|
|
|
|
| Min
| Max
|
|
|
|
|
| Min
| Max
| hFE2 1/
| VCE = 3 V dc
| IC = 6 A dc
|
|
| 1,000
| 18,000
| hFE3 1/
| VCE = 3 V dc
| IC = 12 A dc
|
|
| 150
|
| hfe
| VCE = 3 V dc
| IC = 5 A dc
| f = 1 kHz
|
| 1,000
|
| |hfe|
| VCE = 3 V dc
| IC = 5 A dc
| f = 1 MHz
|
|
10
| 250
| R
θJC
|
|
|
|
°C/W
|
| 1.00
| Cobo
| 100 kHz
≤
f
≥
1 MHz
| VCB = 10 V dc, IE = 0
|
|
pF
|
|
300
|
|
|
|
|
|
|
| Pulse response
|
| ton
| toff
|
|
|
µs
|
µs
|
|
| 2
| 10
|
|
|
|
|
|
|
| VCEO
|
|
|
| V dc
| 80
| 100
| VEBO | IC
|
|
|
|
|
|
| V dc | A dc
| 5
| 12
| 5
| 12
| IB
|
|
|
| A dc
| 0.2
| 0.2
| Tp and TSTG
|
|
|
|
°C
| -55 to +175
| -55 to +175
|
|
|
|
|
|
|
| VBE(sat)
| IC = 12 A dc
| IB = 120 mA dc 1/
|
| V dc
|
|
4.0
| VCE(sat)1
| IC = 12 A dc
| IB = 120 mA dc 1/
|
| V dc
|
|
3.0
| VCE(sat)2
| IC = 6 A dc
| IB = 24 mA dc 1/
|
| V dc
|
|
2.0
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH
43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or
by letter.
1/ Pulsed, see 4.5.1
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-1900/501C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.3).
3.2 Associated detail specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified
herein.
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in
MIL-PRF-19500.
3.4 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified on
figure 1 herein
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750, MIL-PRF-19500, and herein.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
4. QUALITY ASSURANCE PROVISIONS
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
b.
c.
Qualification inspection (see 4.2).
Screening (see 4.3)
Conformance inspection (see 4.4).
2
MIL-PRF-1900/501C
FIGURE 1. Physical dimensions and schematic circuit.
3
MIL-PRF-1900/501C
|
|
| Ltr
|
|
|
|
| CH
|
| LD
|
| CD
|
| PS
|
| PS1
|
|
| HT
|
| LL
|
| L1
|
| MHD
|
|
| MHS
|
| HR
|
| HR1
|
|
| s1
|
|
|
Dimensions
|
|
|
Inches
|
Millimeters
|
|
|
|
| Min
| Max
| Min
| Max
|
|
|
|
| .250
| .328
| 6.35
| 8.33
|
|
|
|
| .038
| .043
| 0.97
| 1.09
|
|
|
|
|
| .875
|
| 22.23
|
|
|
|
| .420
| .440
|10.67
| 11.18
|
|
|
|
| .205
| .225
| 5.21
| 5.72
|
|
|
|
|
|
|
|
| .060
| .135
| 1.52
| 3.43
|
|
|
|
| .312
| .500
| 7.92
| 12.70
|
|
|
|
|
| .050
|
| 1.27
|
|
|
|
| .151
| .161
| 3.84
| 4.09
|
|
|
|
|
|
|
|
|1.177
|1.197
|29.90
| 30.40
|
|
|
|
| .495
| .525
|12.57
| 13.34
|
|
|
|
| .131
| .188
| 3.33
| 4.78
|
|
|
|
|
|
|
|
| .655
| .675
|16.64
| 17.15
|
|
|
|
|
|
| Notes
|
|
|
|
|
|
|5,9,11
|
|3,11
|
|4, 10
|
|4,5,10
|
|
|
|
|5
|
|5, 9
|
|7,11
|
|
|
|
|
|
|6
|
|
|4
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Body contour is optional within zone defined by CD.
4. These dimensions shall be measured at points .050 inch (1.27 mm) to .055 inch (1.40 mm) below the
seating plane. When gauge is not used, measurement shall be made at seating plane.
5. Both terminals.
6. At both ends.
7. Two holes.
8. The collector shall be electrically connected to the case.
9. LD applies between L1 and LL. Diameter is uncontrolled in L1.
10.
The seating plane of the header shall be flat within .001 inch (0.03 mm), concave to .004 inch (0.10 mm),
convex inside a .930 inch (23.62 mm) diameter circle on the center of the header, and flat within .001 inch,
(0.03 mm) concave to .006 inch (0.15 mm), convex overall.
11.
In accordance with ANSI Y14.5M, diameters are equivalent to
∅x
symbology.
FIGURE 1. Physical dimensions and schematic circuit - Continued.
4
MIL-PRF-1900/501C
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (Appendix E, table IV), and
as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table
I herein shall not be acceptable.
| Screen (see
| appendix E,
| table IV of
| MIL-PRF-19500)
|
|
9
|
| 11
|
|
|
| 12
|
| 13
|
|
|
|
Measurements
|
|
|
JANTX and JANTXV levels
|
| ICEX1
|
| ICEX1, hFE2;
∆I
CEX1 = 100 percent of
| initial value or 100
µA
dc; whichever
| is greater.
|
| See 4.3.1
|
| Subgroup 2 of table I herein;
∆I
CEX1= 100 percent of
| initial value or 100
µA
dc, whichever is greater.
|
∆h
FE2 =
±
40 percent of initial value.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
TJ = +162.5°C
±
12.5°C; VCE
≥
10 V dc, TA
≤
+100°C.
NOTE: No heat sink or forced air cooling on the devices shall be permitted.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500, and
table I herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table II
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
appendix E, table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500. Electrical measurements (end-points) and delta requirements
shall be in accordance with the applicable steps of table II herein.
4.4.2.1 Group B inspection, appendix E, table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
B3
Method
1037
Conditions
VCB
≥
10 V dc;
∆T
J = between cycles
≥
+100°C. ton = toff = 3 minutes for 2,000 cycles. No
heat sink or forced-air cooling on the devices shall be permitted.
R
θJC
= 1°C/W (maximum).
B5
3151
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
appendix E, table VII of MIL-PRF-19500. Electrical measurements (end-points) and delta requirements shall be in accordance with the
applicable steps of table II herein.
5
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