REJ09B0054-0500
16
H8S/2258, H8S/2239, H8S/2238,
H8S/2237, H8S/2227
Groups
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8S Family/H8S/2200 Series
HD64F2258
HD6432258
HD6432258W
H8S/2256
HD6432256
HD6432256W
H8S/2239
HD64F2239
HD6432239
HD6432239W
H8S/2238B HD64F2238B
HD6432238B
HD6432238BW
H8S/2238R HD64F2238R
HD6432238R
HD6432238RW
H8S/2236B HD6432236B
HD6432236BW
H8S/2258
H8S/2236R HD6432236R
HD6432236RW
H8S/2237
HD6472237
HD6432237
H8S/2235
HD6432235
H8S/2233
HD6432233
H8S/2227
HD64F2227
HD6432227
H8S/2225
HD6432225
H8S/2224
HD6432224
H8S/2223
HD6432223
Rev. 5.00
Revision Date: Aug 08, 2006
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 5.00 Aug 08, 2006 page ii of lxxxvi
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 5.00 Aug 08, 2006 page iii of lxxxvi
Configuration of This Manual
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Main Revisions in This Edition
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
5. Contents
6. Overview
7. Description of Functional Modules
•
•
CPU and System-Control Modules
On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev. 5.00 Aug 08, 2006 page iv of lxxxvi
Preface
The H8S/2558 Group, H8S/2239 Group, H8S/2238 Group, H8S/2237 Group, and H8S/2227
Group are high-performance microcomputers made up of the internal 32-bit configuration
H8S/2000 CPU as their cores, and the peripheral functions required to configure a system.
A single-power flash memory (F-ZTAT
TM
*) version and masked ROM version are available for
these LSIs’ ROM. These versions provide flexibility as they can be reprogrammed in no time to
cope with all situations from the early stages of mass production to full-scale mass production.
This is particularly applicable to application devices of which the specifications frequently
changeable.
On-chip peripheral functions of each microcomputer are summarized below.
Note: * F-ZTAT is a trademark of Renesas Technology Corp.
Rev. 5.00 Aug 08, 2006 page v of lxxxvi
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