REVISIONS
LTR
A
B
DESCRIPTION
Update boilerplate to current MIL-PRF-38535 requirements. - CFS
Add device types -03 and -04. Reduce the RHA Total Dose from 300krads to
100krads for device types 01 and 02. - CFS
DATE (YR-MO-DA)
07-05-14
08-12-01
APPROVED
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
B
35
B
15
B
36
B
16
B
37
B
17
B
38
B
18
REV
B
39
B
19
B
40
B
20
B
21
B
1
B
22
B
2
B
23
B
3
B
24
B
4
B
25
B
5
B
26
B
6
B
27
B
7
B
28
B
8
B
29
B
9
B
30
B
10
B
31
B
11
B
32
B
12
B
33
B
13
B
34
B
14
SHEET
PREPARED BY
Larry T. Gauder
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles F. Saffle
APPROVED BY
Thomas M. Hess
DRAWING APPROVAL DATE
02-09-26
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL, CMOS, RADIATION
HARDENED, MCS-96 BASED
MICROCONTROLLER, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
SIZE
A
CAGE CODE
67268
1 OF
40
5962-02523
B
DSCC FORM 2233
APR 97
SHEET
5962-E310-08
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
F
02523
03
Q
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
1/
Generic number
UT80CRH196KDS
UT80CRH196KDS
UT80CRH196KDS
UT80CRH196KDS
Circuit function
MCS-96 Based Microcontroller
MCS-96 Based Microcontroller
MCS-96 Based Microcontroller
MCS-96 Based Microcontroller
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
68
Package style
Quad flatpack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
__________
1/ Device types 01 and 03 have an operating temperature range of -55C to +125C, and device types 02 and 04 have an
operating temperature range of -40C to +125C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02523
SHEET
B
2
1.3 Absolute maximum ratings.
1/
-0.3 V to +6.0 V
-0.3 V to V
DD
+0.3 V
10
mA
-65C to +150C
4W
+175C
2C/W
DC supply voltage (V
DD
) ................................................................................................
Voltage on any pin (V
I/O
) ...............................................................................................
DC input current (I
I
) .......................................................................................................
Storage temperature (T
STG
) ...........................................................................................
Maximum power dissipation (P
D
) ..................................................................................
Maximum junction temperature (T
J
) ..............................................................................
Thermal resistance, junction-to-case (
JC
) per MIL-STD-883, method 1012 .................
1.4 Recommended operating conditions.
DC supply voltage (V
DD
) ................................................................................................
Temperature range (T
C
):
Device types 01 and 03 .............................................................................................
Device types 02 and 04 .............................................................................................
DC input voltage (V
IN
) ...................................................................................................
High level input voltage (XTAL1) (V
IH
) ...........................................................................
Low level input voltage (XTAL1) (V
IL
) ............................................................................
Min high level input voltage (V
IH
) ...................................................................................
Max low level input voltage (V
IL
) ....................................................................................
1.5 Radiation features.
Total dose (dose rate = 50 to 300 rad(Si)/s) (Device types 01 and 02) .........................
Total dose (effective dose rate = 1 rad(Si)/s) (Device types 03 and 04) .......................
Single event phenomenon (SEP) effective:
Linear energy threshold (LET) onset, no upsets ........................................................
Linear energy threshold (LET), no latch-up ...............................................................
Neutron fluence .............................................................................................................
1.6 Digital logic testing for device classes Q and V.
+4.5 V to +5.5 V
-55C to +125C
-40C to +125C
0 V to V
DD
0.7V
DD
0.3V
DD
+2.2 V 2/
+0.8 V 2/
100 Krads (Si)
300 Krads (Si)
3/
2
25 MeV-cm /mg 4/
2
128 MeV-cm /mg 4/
2
1.0E14 n/cm 4/
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ............................................................ 97 percent
__________
1/
2/
3/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Except XTAL1 and RESET.
Device types 03 and 04 are irradiated at a dose rate = 50 – 300 rads(Si)/s in accordance with MIL-STD-883, method 1019,
condition A, and are guaranteed to the maximum total dose specified. The effective dose rate after extended room
temperature anneal = 1 rad(Si)/s per MIL-STD-883, method 1019, condition A, section 3.11.2. The total dose specification
for these devices only applies to the specified effective dose rate, or lower, environment.
Limits are guaranteed by design or process, but not production tested unless specified by the customer through the
purchase order or contract.
4/
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02523
SHEET
B
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation or contract.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of Semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA 19428-2959.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02523
SHEET
B
4
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Load circuit and waveforms. The Load circuit and waveforms shall be as specified on figure 4.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 105 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-02523
SHEET
B
5
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