电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HB56UW1673E-F

产品描述128MB Buffered EDO DRAM DIMM 16-Mword 】 72-bit, 4k Refresh, 1 Bank Module (18 pcs of 16M 】 4 components)
文件大小219KB,共27页
制造商ELPIDA
官网地址http://www.elpida.com/en
下载文档 选型对比 全文预览

HB56UW1673E-F概述

128MB Buffered EDO DRAM DIMM 16-Mword 】 72-bit, 4k Refresh, 1 Bank Module (18 pcs of 16M 】 4 components)

文档预览

下载PDF文档
HB56UW1673E-F
Description
The HB 56UW 1673E belongs to 8-byte DI MM (D ual in-line Memory Module) fa mily , and have bee n
developed an optimized main memory solution for 4 and 8-byte processor applications. The HB56UW1673E
is a 16 M
×
72 Dyna mic R AM Module, mounted 18 piec es of 64-Mbit DR AM (H M5165405) sea led in
TS OP pac kage and 2 piec es of 16-bit line drive r sea led in TS SOP pac kage . The HB 56UW 1673E off ers
Extende d Da ta Out (ED O) P age Mode as a high spee d ac ce ss mode. An outline of the HB 56UW 1673E is
168-pin socke t type pac kage (dua l lea d out). The ref ore, the HB 56UW 1673E make s high density mounting
possible without surface mount technology. The HB56UW1673E provides common data inputs and outputs.
Decoupling capacitors are mounted beside each TSOP on the its module board.
Features
168-pin socket type package (Dual lead out)
Lead pitch : 1.27 mm
Single 3.3 V supply : 3.3
±
0.3 V
High speed
Access time: t
RAC
= 50 ns/60 ns (max)
Access time: t
CAC
= 18 ns/20 ns (max)
Low power dissipation
Active mode: 8.46 W/7.16 W (max)
Standby mode (TTL): 166 mW (max)
Buffered input except
RAS
and DQ
4 byte interleave enabled, dual address input (A0/B0)
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
EO
128MB Buffered EDO DRAM DIMM
16-Mword
×
72-bit, 4k Refresh, 1 Bank Module
(18 pcs of 16M
×
4 components)
E0101H10 (1st edition)
(Previous ADE-203-1123A (Z))
Jan. 31, 2001
L
od
Pr
uc
t

HB56UW1673E-F相似产品对比

HB56UW1673E-F HB56UW1673E-5F
描述 128MB Buffered EDO DRAM DIMM 16-Mword 】 72-bit, 4k Refresh, 1 Bank Module (18 pcs of 16M 】 4 components) 128MB Buffered EDO DRAM DIMM 16-Mword 】 72-bit, 4k Refresh, 1 Bank Module (18 pcs of 16M 】 4 components)

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2488  1892  1528  1051  1112  59  39  27  40  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved