HBAT-5400, 5402, 540B, 540C
High Performance Schottky Diode
for Transient Suppression
Data Sheet
Description
The HBAT-540x series of Schottky diodes, commonly
referred to as clipping /clamping diodes, are optimal for
circuit and waveshape preservation applications with
high speed switching. Low series resistance, R
S
, makes
them ideal for protecting sensitive circuit elements
against high current transients carried on data lines.
With picosecond switching, the HBAT-540x can respond
to noise spikes with rise times as fast as 1 ns. Low capaci-
tance minimizes waveshape loss that causes signal deg-
radation.
Features
•
Ultra-low Series Resistance for Higher Current
Handling
•
Low Capacitance
•
Low Series Resistance
•
Lead-free Option Available
Applications
RF and computer designs that require circuit protection,
high-speed switching, and voltage clamping.
Package Lead Code Identification (Top View)
SINGLE
3
SERIES
3
1
0, B
2
1
2, C
2
COMMON
ANODE
3
COMMON
CATHODE
3
1
E
2
1
F
2
Absolute Maximum Ratings, T
A
= 25ºC
Symbol
I
F
I
F- peak
P
T
P
INV
T
J
T
STG
θ
JC
Parameter
DC Forward Current
Peak Surge Current (1µs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
Unit
mA
A
mW
V
°C
°C
°C/W
Absolute Maximum
[1]
HBAT-5400/-5402
HBAT-540B/-540C
0
1.0
50
30
150
-65 to 150
500
430
1.0
85
30
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
[2]
0.08 pF
SPICE Parameters
Parameter
BV
CJO
EG
IBV
IS
N
RS
PB
PT
M
Unit
V
pF
eV
A
A
Ω
V
Value
40
3.0
0.55
10E-4
1.0E-7
1.0
.4
0.6
0.5
2 nH
R
S
SPICE model
Note:
. To effectively model the packaged HBAT-540x product, please refer to
Application Note AN114.
HBAT-540x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Number
HBAT-Code
[2]
Package
Marking
Lead
Code Configuration
V0
V
0
B
C
Maximum
Forward
Voltage
V
BR
(V)
Minimum
Breakdown
Voltage
C
T
(pF)
Typical
Capacitance
R
S
(Ω)
Typical
Series
Resistance
t (ps)
Maximum
Eff. Carrier
Lifetime
Package
Single
Series
V
F
(mV)
SOT-3
SOT-33
(3-lead SC-70)
SOT-3
SOT-33
(3-lead SC-70)
-5400
-540B
-540
-540C
800
[3]
30
[4]
3.0
[5]
.4
100
[6]
Notes:
1. T = +5°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
A
. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
R
= 100 µA; 100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 0 mA guaranteed by design.
Typical Performance
I
F
– FORWARD CURRENT (mA)
I
F
– FORWARD CURRENT (mA)
100
T
J
– JUNCTION TEMPERATURE (C)
300
500
100
160
Max. safe junction temp.
140
120
100
80
60
40
20
0
0
50
100
T
A
= +75C
T
A
= +25C
T
A
= –25C
150
200
250
I
F
– FORWARD CURRENT (mA)
10
10
1
1
0.1
0.01
T
A
= +75C
T
A
= +25C
T
A
= –25C
0
0.1
0.2
0.3
0.4
0.5
0.6
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
T
A
= +75C
T
A
= +25C
T
A
= –25C
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
I
F
– FORWARD CURRENT (mA)
Figure 1. Forward Current vs. Forward Voltage at
Temperature for HBAT-5400 and HBAT-5402.
Figure 2. Forward Current vs. Forward Voltage at
Temperature for HBAT-540B and HBAT-540C.
Figure 3. Junction Temperature vs. Current as a
Function of Heat Sink Temperature for HBAT-5400
and HBAT-5402.
Note: Data is calculated from SPICE parameters.
T
j
– JUNCTION TEMPERATURE (C)
160
Max. safe junction temp.
140
120
100
80
60
40
20
0
0
100
200
300
T
A
= +75C
T
A
= +25C
T
A
= –25C
400
500
600
I
F
– FORWARD CURRENT (mA)
C
T
– TOTAL CAPACITANCE (pF)
3.0
2.5
2.0
1.5
1.0
0
5
10
15
20
V
R
– REVERSE VOLTAGE (V)
Figure 4. Junction Temperature vs. Current as a
Function of Heat Sink Temperature for HBAT-540B
and HBAT-540C.
Note: Data is calculated from SPICE parameters.
Figure 5. Total Capacitance vs. Reverse Voltage.
Device Orientation
For Outlines SOT-23/323
REEL
TOP VIEW
4 mm
END VIEW
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
3
Package Dimensions
Outline SOT-23
e2
e1
Recommended PCB Pad Layout for Avago’s
SOT-23 Products
0.039
1
0.039
1
E
XXX
e
E1
0.079
2.0
L
B
D
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
C
DIMENSIONS (mm)
MIN.
0.79
0.000
0.37
0.086
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.152
3.13
1.50
1.02
2.04
0.60
2.70
0.69
0.035
0.9
0.031
0.8
Dimensions in
inches
mm
A
A1
Notes:
XXX-package marking
Drawings are not to scale
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
P
2
E
P
0
F
W
t1
D
1
9° MAX
Ko
8° MAX
13.5° MAX
A
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 –0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
B
0
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 –0.004
0.009
±
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
4
Package Dimensions
Outline SOT-323 (SC-70 3 Lead)
e1
Recommended PCB Pad Layout for Avago’s
SC70 3L/SOT-323 Products
0.026
E
XXX
e
E1
L
B
D
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
C
DIMENSIONS (mm)
MIN.
MAX.
0.80
1.00
0.00
0.10
0.15
0.40
0.10
0.20
1.80
2.25
1.10
1.40
0.65 typical
1.30 typical
1.80
2.40
0.425 typical
0.079
0.039
A
0.022
Dimensions in inches
A1
Notes:
XXX-package marking
Drawings are not to scale
Tape Dimensions and Product Orientation
For Outline SOT-323 (SC-70 3 Lead)
P
P
0
E
D
P
2
F
W
C
t
1
(CARRIER TAPE THICKNESS)
D
1
T
t
(COVER TAPE THICKNESS)
8° MAX.
K
0
8° MAX.
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
WIDTH
TAPE THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t
1
C
T
t
F
P
2
SIZE (mm)
2.40
±
0.10
2.40
±
0.10
1.20
±
0.10
4.00
±
0.10
1.00 + 0.25
1.55
±
0.05
4.00
±
0.10
1.75
±
0.10
8.00
±
0.30
0.254
±
0.02
5.4
±
0.10
0.062
±
0.001
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.094
±
0.004
0.094
±
0.004
0.047
±
0.004
0.157
±
0.004
0.039 + 0.010
0.061
±
0.002
0.157
±
0.004
0.069
±
0.004
0.315
±
0.012
0.0100
±
0.0008
0.205
±
0.004
0.0025
±
0.00004
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
COVER TAPE
DISTANCE
5
嵌入式系统
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