5/21/12
2519B-EP11-BGS5G - heatsinks for BGA Devices
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BGA Heat Sinks
2519B-EP11-BGS5G
Pin Fin heat sink with BGS Clip attachment
RoHS: compliant
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Features
BGS Clip saves board space by eliminating mounting holes
End plates firmly engage the device while springs apply mounting pressure
Pin Fin array allows omni-directional airflow to maximize heat dissipation
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Width: 34.50
Length: 31.40
Height: 15.60
Base Thickness: 4.19
Fin Thickness: Length 2.01, Width 1.75
# of Fins: Length 9, Width 9
Fin Tip to Tip: 0.00
Finish: Black Anodize
Thermal Performance
Natural Convection: 19.70
(based on a heatsink temperature rise of 75°C above ambient)
Forced convection: 6.30
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5/21/12
2519B-EP11-BGS5G - heatsinks for BGA Devices
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
Thermal Curve:
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Aavid will lead the electronics thermal management industry worldwide. We will be the first company customers call to enable their thermal designs anywhere in the world. We will respond with
extraordinary speed and will provide them with timely and cost-effective solutions because we understand their needs, their industry, and their culture. 2012 Aavid Thermalloy, LLC
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