Quad. Bus Buffer Gates (with 3-state outputs)
HD74HCT126 | HD74HCT125 | HD74HCT125P | HD74HCT125FPEL | HD74HCT126FPEL | HD74HCT126TELL | HD74HCT125TELL | |
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描述 | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) | Quad. Bus Buffer Gates (with 3-state outputs) |
是否无铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | - | 不符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
零件包装代码 | - | - | DIP | SOIC | SOIC | TSSOP | TSSOP |
包装说明 | - | - | 6.30 X19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14 | 5.50 X 10.06 MM, 1.27 MM PITCH, PLASTIC, SOP-14 | 5.50 X 10.06 MM, 1.27 MM PITCH, PLASTIC, SOP-14 | 4.40 X 5 MM, 0.65 MM PITCH, PLASTIC, TSSOP-14 | TSSOP, TSSOP14,.25 |
针数 | - | - | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | - | - | unknown | compliant | compliant | compli | compli |
ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
控制类型 | - | - | ENABLE LOW | ENABLE LOW | ENABLE HIGH | ENABLE HIGH | ENABLE LOW |
系列 | - | - | HCT | HCT | HCT | HCT | HCT |
JESD-30 代码 | - | - | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
长度 | - | - | 19.2 mm | 10.06 mm | 10.06 mm | 5 mm | 5 mm |
负载电容(CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | - | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
位数 | - | - | 1 | 1 | 1 | 1 | 1 |
功能数量 | - | - | 4 | 4 | 4 | 4 | 4 |
端口数量 | - | - | 2 | 2 | 2 | 2 | 2 |
端子数量 | - | - | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | - | - | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | DIP | SOP | SOP | TSSOP | TSSOP |
封装等效代码 | - | - | DIP14,.3 | SOP14,.3 | SOP14,.3 | TSSOP14,.25 | TSSOP14,.25 |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | 260 | 260 | 260 | 260 |
电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
传播延迟(tpd) | - | - | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 5.06 mm | 2.2 mm | 2.2 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | - | NO | YES | YES | YES | YES |
技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | - | - | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | - | 7.62 mm | 5.5 mm | 5.5 mm | 4.4 mm | 4.4 mm |
Base Number Matches | - | - | 1 | 1 | 1 | 1 | - |
湿度敏感等级 | - | - | - | 1 | 1 | 1 | 1 |
包装方法 | - | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
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