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HM62V16100LBPI-4: 产品描述Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit); 产品类别存储存储; 文件大小207KB，共25页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HM62V16100LBPI-4概述

Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)

HM62V16100LBPI-4规格参数

参数名称	属性值
零件包装代码	BGA
包装说明	TFBGA, BGA48,6X8,30
针数	48
Reach Compliance Code	unknown
ECCN代码	3A991.B.2.A
最长访问时间	45 ns
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B48
长度	9.5 mm
内存密度	16777216 bit
内存集成电路类型	STANDARD SRAM
内存宽度	16
功能数量	1
端子数量	48
字数	1048576 words
字数代码	1000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	1MX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA48,6X8,30
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
电源	3/3.3 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最小待机电流	1.5 V
最大压摆率	0.05 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
宽度	8 mm
Base Number Matches	1

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HM62V16100I Series

Wide Temperature Range Version

16 M SRAM (1-Mword

16-bit)

REJ03C0060-0200Z

Rev. 2.00

Oct.06.2003

Description

The HM62V16100I Series is 16-Mbit static RAM organized 1-Mword

16-bit. HM62V16100I Series has

realized higher density, higher performance and low power consumption by employing CMOS process

technology (6-transistor memory cell). It offers low power standby power dissipation; therefore, it is

suitable for battery backup systems. It has the package variations of 48-bump chip size package with 0.75

mm bump pitch and 48-pin plastic TSOPI for high density surface mounting.

Features

•

Single 3.0 V supply: 2.7 V to 3.6 V

•

Fast access time: 45/55 ns (max)

•

Power dissipation:



Active: 9 mW/MHz (typ)



Standby: 1.5

µW

(typ)

•

Completely static memory.



No clock or timing strobe required

•

Equal access and cycle times

•

Common data input and output.



Three state output

•

Battery backup operation.



2 chip selection for battery backup

•

Temperature range:

−40

to +85°C

Rev.2.00, Oct.06.2003, page 1 of 23

HM62V16100LBPI-4相似产品对比

	HM62V16100LBPI-4	HM62V16100I	HM62V16100LTI-4	HM62V16100LTI-4SL	HM62V16100LTI-5SL	HM62V16100LBPI-5SL	HM62V16100LBPI-4SL
描述	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)	Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)
零件包装代码	BGA	-	TSOP1	TSOP1	TSOP1	BGA	BGA
包装说明	TFBGA, BGA48,6X8,30	-	TSOP1,	TSOP1,	TSOP1,	TFBGA,	0.75 MM PITCH, CSP-48
针数	48	-	48	48	48	48	48
Reach Compliance Code	unknown	-	unknow	unknown	unknow	unknow	unknown
ECCN代码	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	45 ns	-	45 ns	45 ns	55 ns	55 ns	45 ns
JESD-30 代码	R-PBGA-B48	-	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48
长度	9.5 mm	-	18.4 mm	18.4 mm	18.4 mm	9.5 mm	9.5 mm
内存密度	16777216 bit	-	16777216 bi	16777216 bit	16777216 bi	16777216 bi	16777216 bit
内存集成电路类型	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	16	-	16	16	16	16	16
功能数量	1	-	1	1	1	1	1
端子数量	48	-	48	48	48	48	48
字数	1048576 words	-	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	-	1000000	1000000	1000000	1000000	1000000
工作模式	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	1MX16	-	1MX16	1MX16	1MX16	1MX16	1MX16
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	-	TSOP1	TSOP1	TSOP1	TFBGA	TFBGA
封装形状	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最大供电电压 (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	-	YES	YES	YES	YES	YES
技术	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	-	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.75 mm	-	0.5 mm	0.5 mm	0.5 mm	0.75 mm	0.75 mm
端子位置	BOTTOM	-	DUAL	DUAL	DUAL	BOTTOM	BOTTOM
宽度	8 mm	-	12 mm	12 mm	12 mm	8 mm	8 mm
厂商名称	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	-

HM62V16100LBPI-4

HM62V16100LBPI-4概述

HM62V16100LBPI-4规格参数

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