Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best pos-
sible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The Company makes no representations that circuitry
described herein is free from patent infringement or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent, patent rights or other
rights, of Integrated Device Technology, Inc.
LIFE SUPPORT POLICY
Integrated Device Technology's products are not authorized for use as critical components in life support devices or systems unless a specific written agreement pertaining to such intended use is exe-
cuted between the manufacturer and an officer of IDT.
1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform, when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any components of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
Table of Contents
FEATURES .............................................................................................................................................................................. 7
MAIN FEATURES ............................................................................................................................................................................................ 7
OTHER FEATURES ......................................................................................................................................................................................... 7
3.5.2 Frequency Monitoring ................................................................................................................................................................... 19
3.7.1.1 Fast Loss .......................................................................................................................................................................... 22
3.7.1.2 Coarse Phase Loss .......................................................................................................................................................... 22
3.7.1.3 Fine Phase Loss ............................................................................................................................................................... 22
3.7.1.4 Hard Limit Exceeding ....................................................................................................................................................... 22
3.7.2 Locking Status ............................................................................................................................................................................... 22
3.11.5 Four Paths of T0 DPLL Outputs .................................................................................................................................................... 30
POWER SUPPLY FILTERING TECHNIQUES ............................................................................................................................................. 37
LINE CARD APPLICATION .......................................................................................................................................................................... 38
6 PROGRAMMING INFORMATION .................................................................................................................................... 42
6.2.1 Global Control Registers ............................................................................................................................................................... 47
6.2.6 T0 DPLL State Machine Control Registers .................................................................................................................................. 83
JUNCTION TEMPERATURE ...................................................................................................................................................................... 103
EXAMPLE OF JUNCTION TEMPERATURE CALCULATION ................................................................................................................... 103
ABSOLUTE MAXIMUM RATING ................................................................................................................................................................ 104
Related Bit / Register in Chapter 3.2 ........................................................................................................................................................... 15
Related Bit / Register in Chapter 3.3 ........................................................................................................................................................... 16
Related Bit / Register in Chapter 3.4 ........................................................................................................................................................... 17
Related Bit / Register in Chapter 3.5 ........................................................................................................................................................... 19
Input Clock Selection for T0 Path ................................................................................................................................................................ 20
External Fast Selection ................................................................................................................................................................................ 20
‘n’ Assigned to the Input Clock ..................................................................................................................................................................... 21
Related Bit / Register in Chapter 3.6 ........................................................................................................................................................... 21
Coarse Phase Limit Programming (the selected input clock of 2 kHz, 4 kHz or 8 kHz) .............................................................................. 22
Coarse Phase Limit Programming (the selected input clock of other than 2 kHz, 4 kHz and 8 kHz) .......................................................... 22
Related Bit / Register in Chapter 3.7 ........................................................................................................................................................... 23
Conditions of Qualified Input Clocks Available for T0 Selection ................................................................................................................. 24
Related Bit / Register in Chapter 3.8 ........................................................................................................................................................... 25
T0 DPLL Operating Mode Control ............................................................................................................................................................... 26
Frequency Offset Control in Temp-Holdover Mode ..................................................................................................................................... 28
Frequency Offset Control in Holdover Mode ............................................................................................................................................... 29
Holdover Frequency Offset Read ................................................................................................................................................................ 29
Related Bit / Register in Chapter 3.12 ......................................................................................................................................................... 31
Outputs on OUT1 & OUT2 if Derived from T0 DPLL Outputs ..................................................................................................................... 31
Outputs on OUT1 & OUT2 if Derived from T0 APLL ................................................................................................................................... 32
Outputs on OUT1 & OUT2 if Derived from T4 APLL ................................................................................................................................... 33
Frame Sync Input Signal Selection .............................................................................................................................................................. 34
Synchronization Control ............................................................................................................................................................................... 34
Related Bit / Register in Chapter 3.13 ......................................................................................................................................................... 35
Related Bit / Register in Chapter 3.14 ......................................................................................................................................................... 36
Read Timing Characteristics in Serial Mode ................................................................................................................................................ 40
Write Timing Characteristics in Serial Mode ................................................................................................................................................ 40
Register List and Map .................................................................................................................................................................................. 42
Power Consumption and Maximum Junction Temperature ....................................................................................................................... 103
Thermal Data ............................................................................................................................................................................................. 103
Absolute Maximum Rating ......................................................................................................................................................................... 104
在全球半导体产业因景气不佳而纷传并购、整合之际,两大IT巨头三星、IBM日前却双双宣布,将强化半导体产业投资。 三星电子本周一宣布,已向韩国证券交易所提交一份申请文件,打算2008年投下10.5亿美元,用于升级内存芯片生产线、改进技术工艺,从而提高产能并降低成本。无独有偶。本周二IBM公司宣布,未来3年将投资10亿美元,用于扩充位于纽约州 East Fishkill 的半导体工厂,以消...[详细]