电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

177TW-B-21W1-S-HP3SV-4F-RM6

产品描述D Subminiature Connector, 21 Contact(s), Female, Solder Terminal
产品类别连接器    连接器   
文件大小2MB,共15页
制造商Amphenol(安费诺)
官网地址http://www.amphenol.com/
下载文档 详细参数 全文预览

177TW-B-21W1-S-HP3SV-4F-RM6概述

D Subminiature Connector, 21 Contact(s), Female, Solder Terminal

177TW-B-21W1-S-HP3SV-4F-RM6规格参数

参数名称属性值
Objectid1720575246
Reach Compliance Codeunknown
ECCN代码EAR99
YTEOL8.77
连接器类型D SUBMINIATURE CONNECTOR
联系完成配合GOLD (30) OVER NICKEL
联系完成终止TIN
触点性别FEMALE
DIN 符合性NO
空壳NO
滤波功能NO
IEC 符合性NO
绝缘体材料POLYETHYLENE
JESD-609代码e3
MIL 符合性NO
制造商序列号177TW
混合触点YES
安装类型BOARD AND PANEL
选件GENERAL PURPOSE
外壳面层TIN
外壳材料STEEL
外壳尺寸B
端接类型SOLDER
触点总数21

文档预览

下载PDF文档
17 TW S
ERIES
S
PECIFICATIONS
:
M
ATERIALS
Shells
Insulators
Signal Contacts
Female
Male
Plating
Coax Contacts
Female
Male
Plating
AND
Hybrid Connector
P
LATINGS
Steel with tin plating or yellow chromate
with or without grounding dimples
High temperature black thermoplastic
Machined bronze
Machined brass
16µ"(.40µm) or 30µ"(.76µm) gold
over 79µ"(1.97µm) nickel
Machined bronze
Machined brass
Inner conductor: 16µ"(.40µm) gold
or 30µ"(.76µm) gold over 79µ"(1.97µm) nickel
Outer ring: 10µ"(.25µm) gold over 79µ"(1.97µm) nickel
Tinned.
(Solder cup and crimp terminations are gold flash.)
Amphenol’s 17TW series hybrid
D-Subminiature connectors are
available with power, coax, high
voltage and signal contacts
assembled in the same connector
body. These connectors are
supplied with screw-machined
contacts which are fixed in the
insulator.
The board-mount product
offering includes straight and
right-angle terminations. The
cable connectors are available in
crimp and solder terminations.
These connectors are compatible
with the infra-red reflow
soldering process. The 17TW
series offers eighteen housing
configurations in five shell sizes.
Industrial
Telecom
Any industry standard
I / O connections
Terminations
Power Contacts
Female
Machined bronze
Male
Machined brass
Plating
Contacts: 16µ"(.40µm) gold or 30µ"(.76µm) gold
over 79µ"(1.97µm) nickel
Terminations
Tinned.
(Solder cup and crimp terminations are gold flash.)
Brackets
Steel with tin plating
Front Jackscrews Brass with tin plating or yellow chromate
Rear Clinch Nuts
Brass with tin plating or yellow chromate
Boardlocks:
Bronze with tin plating
Stand-offs
Brass with tin plating
E
LECTRICAL
D
ATA
Current Rating:
Signal Contacts
7.5 amps with 10 amp peaks
Power Contacts: PCB, Solder-Cup, Crimp 10 to 40 amps
0.5 amps
Current Rating:
Signal & Power Contacts 300 VRMS at 50 Hz
Coax Contacts
150 VRMS at 50 Hz
Coax Contacts
Frequency range:
0 -1 GHz
Attenuation:
0.2 dB
V.S.W.R.:
1.4 (+0.04/GHz)
Characteristic Impedance
50 Ohms
Dielectric Withstanding Voltage
1000V R.M.S. at 50Hz
Insulation Resistance
5000 megaohms at 500 V D.C.
Contact Resistance
≤5
milliohms
Shell Resistance (electrical grounding)
≤1
milliohm
C
LIMATIC
D
ATA
Shell Resistance (electrical grounding)
≤1
milliohm
Operating Temperature
67°F (-55°C) to 311°F (+155°C)
with peaks up to 356°F (180°C)
Damp Heat
56 days 104°F (40°C) at 95% RH
Salt Spray
48 hours
M
ECHANICAL
D
ATA
Contact Retention Force in Dielectric Material
>40 N
Maximum Mating and Unmating Force
with dimples
A size: 80 N B size: 100 N C size: 150 N
D size: 180 N E size: 70 N
without dimples
A size: 50 N B size: 80 N C size: 120 N
D size: 160 N E size: 30 N
Process Compatibility
IR - air convection: 500°F (260°C) for 20 seconds
Soldering iron: 500°F (260°C) for 30 seconds
Mating Cycles
200 (16µ"(.41µm) gold)
500 (30µ"(.76µm) gold)
Blind Mating System Available upon request
Polarization
Available with locking accessories, consult factory
Derating Curves for Power Contacts:
see page 51
Pull-out Force for Crimped Contacts:
see page 51
Approvals:
UL - File number: E 64911 / CSA - File number: LR 57744
Shell Dimensions:
See page 64
T
ELEPHONE
: (416) 754-5656
F
AX
: (416) 754-8668 E-M
AIL
:
SALES
@
AMPHENOLCANADA
.
COM
37
fpga的最大可用io数遇到的问题
今天发现了一个问题,就是我用quartus ii的时候显示的芯片可用io数与handbook中的数据有出入, 比如cycloniii中的ep3c16f484,在quartus里面显示的最大可用io是347,而在cyclonehandbook中说最 ......
woaiwojia1988 FPGA/CPLD
继续讨论STM32的IAP
我们目前一个产品用STM32做的,用IAP实现免开机壳升级。 目前的做法是在Flash专门开了一个Loader区域,而不是放在RAM中。 现在问题来了,FLASH不够用了,想把Loader挪到RAM中去运行。 ......
twinspace stm32/stm8
求一个间距为0.2MM的FPC连接器的规格书
最近需要用到一个间距为0.2MM的FPC连接器,但是目前找不到规格书与供应商,求各位大神告知,不胜感激...
樱花锦 下载中心专版
锁相环CD4046应用介绍
锁相环CD4046应用介绍...
fighting 模拟电子
TI LaunchPad精品课程学习资料收集---MSP430全系列选型(中文)
很全,很详细的选型,不只是MCU型号的简单罗列,而是有各种模块的简单介绍。有一些答案可以直接在这篇文档里找到哦87340...
tiankai001 微控制器 MCU
求TMP87P809N/TMP86FH09NG/HMS87C1204A
求TMP87P809N/TMP86FH09NG/HMS87C1204A芯片中文手册,希望能得到帮助,很急很急。。。 woldcow@163.com QQ:173104289...
powerding 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 379  546  2868  151  2298  10  19  2  52  35 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved